Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

USB 3.0 Connectors – The Gate to High Speed

14.9.2021
Reading Time: 2 mins read
A A

The new USB 3.0 standard, also known as USB Super Speed, brings about an impressive ten time increase in bandwidth, compared to the old USB 2.0 standard which tops out at 480 Mbps. This makes it theoretically possible to transfer a 25 GB HD movie in only 1 minute and 10 seconds (versus 15 min with USB 2.0). Simultaneously, the power capacity is increased by 80% compared to USB 2.0. And of course, backward compatibility with former USB standards (2.0 and 1.1) is maintained.

History, Implementation and Main Purpose
The new communication technologies generate an enormous amount of content while storage is simultaneously becoming inexpensive. Therefore, the USB Implementers Forum (USB-IF) acknowledged the need for a new generation of interconnection technologies and released the USB 3.0 specification on November 12th, 2008. This was initiated by the promoter group made up of the following 6 companies: Intel, HP, Microsoft, NEC, Texas Instrument and NXP.

RelatedPosts

Polymer Materials and Processing

What is RF Connector

Connector Materials and Processes

Its initial goal is to offer the same ease of use as USB 2.0, hot plugging functionality, with enhanced power management and a higher data rate. If higher data rate is always pointed out, we must not forget that power management is also a key feature of this new USB protocol since “Sync & Go” applications need to trade off features for battery life.

USB 3.0 aims to bring the following improvements compared to USB 2.0:

• Up to 10x higher data rate than USB 2.0 (4.8Gbps vs. 480Mbps)
• Separate data lanes for up & download enable to read and store files at the same time
• Thanks to higher current capacities, quicker charge of mobile devices through USB
• Better power efficiency thanks to the interrupt-driven protocol
• Backward-compatibility with USB 2.0 standard

Fig. 2.131: Data rate evolution (based on Microsoft tests showed at Win HEC Nov 6, 2008)

Related

Source: Wurth elektronik

Recent Posts

Connector PCB Design Challenges

3.10.2025
39

Non-Magnetic Interconnects

23.4.2025
27

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025
56

Polymer Materials and Processing

11.8.2025
60

Basic PCB Technology Overview

1.7.2025
24

What is RF Connector

17.12.2024
14

Creepage and Clearance of Connector

25.7.2025
24

Microwave Multi Line Connectors Mounting and Handling Precautions

11.8.2025
3

BASIC PCB Design Rules – Layout

1.7.2025
35

MEMR RF Relay for Space Compact Redundancy Ring

17.12.2024
4

Upcoming Events

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version