Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Vishay T55 Polymer Tantalum Chip Capacitors Now Available in 7343-19 Z Case Size

7.2.2019
Reading Time: 1 min read
A A

Source: Vishay news

MALVERN, Pa. — Feb. 6, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its T55 series of vPolyTan™ surface-mount polymer tantalum molded chip capacitors with new devices in the Z case (EIA 7343-19) size.

RelatedPosts

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

How to Select Ferrite Bead for Filtering in Buck Boost Converter

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

With a 0.1 mm lower height than devices in the standard V case (EIA 7343-20), the Vishay Polytech capacitors released today increase package density and enable the design of thinner end products. The devices are optimized for power management, battery decoupling, and energy storage in computers, servers, network infrastructure equipment, solid-state drives, and wireless transceivers.

Offered in the compact J, P, A, B, T (low-profile B — 1.2 mm max), D, V, and Z case sizes, the T55 series features a wide capacitance range from 3.3 µF to 680 µF, over voltage ratings from 2.5 V to 63 V, and a capacitance tolerance of ± 20 %. The capacitors provide ultra low ESR from 500 mΩ down to 7 mΩ at +25 °C, a result of their polymer cathodes, which offer greatly enhanced performance over manganese dioxide devices. Capacitance values up to 1000 µF and ESR values down to 6 mW are in development.

Operating over a temperature range of -55 °C to +105 °C, the capacitors offer excellent ripple current rating up to 5.66 A IRMS and provide low internal resistance for enhanced charge and discharge characteristics. Featuring lead (Pb)-free terminations, the T55 series is RoHS-compliant, halogen-free, and Vishay Green. The devices are compatible with high volume automatic pick and place equipment and offer a Moisture Sensitivity Level (MSL) of 3.

Samples and production quantities of the T55 series capacitors in the Z case size are available now, with lead times of 12 to 14 weeks.

Related

Recent Posts

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
10

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
27

Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

23.10.2025
3

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
7

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
36

Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

20.10.2025
12

Bourns Release Automotive 4-Terminal Shunt Resistors

17.10.2025
21

Bourns Releases High Inductance Common Mode Choke

16.10.2025
21

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

16.10.2025
15

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
26

Upcoming Events

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

Oct 30
11:00 - 12:00 CET

Space Ceramic Capacitors with Flexible Testing

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version