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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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Yageo, Hon Hai Foxconn Form Alliance to Develop Advanced Passive Components

5.10.2020
Reading Time: 2 mins read
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Yageo Corp (國巨), the world’s third-largest supplier of multilayer ceramic capacitors, has formed a strategic alliance with Hon Hai Precision Industry Co (鴻海精密) – Foxconn to develop key electronic components for electric vehicles and digital healthcare.

The alliance is to help Yageo boost its revenue from high-end components for vehicles and industrial, medical and aerospace devices, as well as those used in 5G and Internet-of-Things devices, the company said.

RelatedPosts

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

The companies signed the strategic alliance agreement at Yageo’s headquarters in New Taipei City’s Sindian District (新店).

Their cooperation is to start this quarter, the companies said in a joint statement.

“Through the cooperation with Hon Hai, we are able to enlarge our mutual technological benefits and resource sharing to maximize the value of both groups and see multiple growths in the future,” Yageo chairman Pierre Chen (陳泰銘) said.

The passive components maker would invest resources in advancing new technology development platforms for Hon Hai to provide customized and advanced electronic components primarily used in electric vehicles, medical treatment, artificial intelligence, robots and 5G devices.

The combination of global production, and operational and technical capabilities of high-end key electronic components would provide them win-win results and create even higher value, the statement said.

Yageo would not only focus on supplying the high-end 5G, automotive, industrial, aerospace and medical segments, but also provide its expertise and one-stop shopping platform for special semiconductor packaging and testing services, following a series of mergers and acquisitions, such as Fort Lauderdale, Florida-based Kemet Corp, it said.

“Through this strategic alliance, we will focus more on the development of new customers and products with joint resources to meet global customers’ needs in supporting the supply chain and functional design development, and come up with more value-added solutions,” Hon Hai chairman Young Liu (劉揚偉) said in the statement.

Yageo has 15 design and research and development centers and 42 manufacturing sites around the world and is a provider of quality design-in services.

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Source: Taipei Times

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