Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Automotive are projected as the fastest growing electronics systems segment

26.11.2018
Reading Time: 2 mins read
A A
Back view of automobile in sales salon

Back view of automobile in sales salon

source: EE Times news

By Dylan McGrath, EE Times, Automotive electronics systems are projected to grow the fastest of the six major end markets for semiconductors through 2021, as technology advancements continue to increase the electronic content of vehicles, according to a forecast by market research firm IC Insights.

RelatedPosts

Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

Sales of automotive electronic systems are forecast to  grow 7% this year, reaching $152 billion, before growing an additional 6.3% next year to reach $162 billion, according to the Scottsdale, Ariz.-based market watcher. The firm projects that automotive electronic systems sales will increase at a compound annual growth rate of 6.4% from 2017 to 2021, topping all other major electronic systems categories.

The latest IC Insights forecast calls for the global electronic systems market to be worth $1.62 trillion this year. The firm expects automotive electronics systems to account for 9.4% of that total, up slightly from 9.1% last year.

While it is expected to grow fastest, the automotive electronics systems market remains relatively small compared to other major electronics systems markets, including communications, computers, industrial/medical and consumer, according to IC Insights.

In recent years, electronics content in vehicles has been growing rapidly as new technologies such as ADAS, communications, infotainment and others crowd the cockpit of cars. IC  Insights said other technologies focused on autonomous vehicles, vehicle-to-vehicle communications, on-board safety, convenience and environmental features will continue to lift the market for autonomous systems in cars.

Increasingly, new advancements are available in mid-range and entry-level cars as aftermarket products, which has further raised automotive systems growth in recent years, IC Insights said.

Automotive electronic systems growth is good news for markers of MCUs, analog ICs and sensors in particular, IC Insights said. The firm said that the market for special purpose logic chips for automotive is expected to increase by 29% this year while application-specific analog IC sales for automotive are projected to grows by 14% this year as backup cameras, blind-spot detectors and other systems are added to more vehicles.  The firm added that DRAM and flash memory are increasingly playing a more critical role in the development of new automotive system solutions used in vehicles.

 

Related

Recent Posts

Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

29.8.2025
3

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

29.8.2025
10

Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

28.8.2025
10

Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

28.8.2025
12

Ripple Steering in Coupled Inductors: SEPIC Case

27.8.2025
12

TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

27.8.2025
10

Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

27.8.2025
26

SEPIC Converter with Coupled and Uncoupled Inductors

26.8.2025
21

Coupled Inductors in SEPIC versus Flyback Converters

26.8.2025
14

Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

25.8.2025
15

Upcoming Events

Sep 3
15:30 - 17:30 CEST

How to Choose Your Magnetic Supplier

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version