- News
- All
- Aerospace & Defence
- Antenna
- Applications
- Automotive
- Capacitors
- Circuit Protection Devices
- electro-mechanical news
- Filters
- Fuses
- Inductors
- Industrial
- Integrated Passives
- inter-connect news
- Market & Supply Chain
- Market Insights
- Medical
- Modelling and Simulation
- New Materials & Supply
- New Technologies
- Non-linear Passives
- Oscillators
- Passive Sensors News
- Resistors
- RF & Microwave
- Telecommunication
- Weekly Digest
- Video
- News
- All
- Aerospace & Defence
- Antenna
- Applications
- Automotive
- Capacitors
- Circuit Protection Devices
- electro-mechanical news
- Filters
- Fuses
- Inductors
- Industrial
- Integrated Passives
- inter-connect news
- Market & Supply Chain
- Market Insights
- Medical
- Modelling and Simulation
- New Materials & Supply
- New Technologies
- Non-linear Passives
- Oscillators
- Passive Sensors News
- Resistors
- RF & Microwave
- Telecommunication
- Weekly Digest
- Video
News
Stackpole Current Sense Resistors Offer Values Down to 2 milliohms
Source: Stackpole news RALEIGH, NC (May 24, 2019) –Stackpole’s CSRF0603-HP is a 0.5W rated foil on ceramic current sense chip...
Read moreDetailsElectric Vehicles and Aerials Go High Voltage
Source: IDTechEx news The new IDTechEx report, Electric Vehicles 2020-2030 is the most thorough on the subject with 100 categories...
Read moreDetailsNew Report Forecasts E-Textiles will Reach Over $2 Billion by 2029
Source: IDTechEx news IDTechEx have released the latest edition of the most comprehensive report on the e-textiles industry. "E-Textiles 2019-2029:...
Read moreDetailsVishay High Saturation Inductor Shortlisted as Electronics Industry Awards 2019 Finalist
Source: Vishay news MALVERN, Pa., May 28, 2019 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its...
Read moreDetailsScientists find a way to increase the capacity of supercapacitors for portable electronics
Source: Skolkovo Institute of Science and Technology - Skoltech news Scientists from Skoltech, Moscow State University (MSU) and Moscow Institute...
Read moreDetailsQ1 was worst quarterly semi performance for 10 years
Source: Electronics Weekly news In Q1 the chip market posted its worst quarterly performance in 10 years, according to IHS...
Read moreDetailsKemet’s KONNEKT MLCC Stacking Package is Minimizing the Footprint while Maximizing the Capacitance
Source: Kemet Engineering Center article KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally...
Read moreDetailsCross Sectioning of EEE Parts Enables Close Look into its Internal Structure
Source: Alter Technology article The cross-sectioning process provides access to the device internal structure, its materials and design. Such components...
Read moreDetailsPolymers may be the key to single-molecule electronic devices
Source: Tokyo Institute of Technology news Scientists at Tokyo Institute of Technology and University of Tsukuba demonstrate that polymers could...
Read moreDetailsFunctional Safety for Automotive HMI Systems
Source: EE Times article by Kishore Kumar Sukumar, Dr. Martin Oberkönig, Sivaguru Noopuran, Cypress The number of processors and components...
Read moreDetailsPopular Posts
-
Buck Converter Design and Calculation
-
Boost Converter Design and Calculation
-
Flyback Converter Design and Calculation
-
LLC Resonant Converter Design and Calculation
-
Dual Active Bridge (DAB) Topology Explained
-
Ripple Current and its Effects on the Performance of Capacitors
-
What is a Dielectric Constant and DF of Plastic Materials?
-
SEPIC Converter Design and Calculation
-
How to Design an Inductor
-
Core Materials, Permeability and Their Losses
© EPCI - Leading Passive Components Educational and Information Site