Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Characterization of 70GHz Thin Film Chip Resistors

26.4.2025
Reading Time: 5 mins read
A A

This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin Nicolle and Alexandre Moulin, VISHAY Sfernice SA, France during the 5th Space Passive Component Days (SPCD), an International Symposium held from October 15th to 18th, 2024, at ESA/ESTEC in Noordwijk, the Netherlands. Published under permission from ESA SPCD organizers.

Introduction

RelatedPosts

ESA SPCD 26 Registration Open

High-Density PCB Assemblies For Space Applications

Solid State Polymer Multilayer Capacitors For High Temperature Application

The evolution of wireless technologies heavily relies on high-frequency circuits, which are crucial for faster data transmission across sectors such as military, aerospace, automotive, and mobile 5G.

Passive components, including resistors, must adapt to these high-frequency demands. This paper, presented at the 5th Space Passive Component Days (SPCD), focuses on measuring S-parameters and deducing impedance values of Vishay’s CHA series thin film chip resistors at frequencies up to 70 GHz.

The goal is to demonstrate the high stability and reliability of these SMD chip resistors, especially under stringent AEC-Q200 tests designed to simulate extreme environmental conditions.

Key Points

  • The CHA series thin film chip resistors are optimized for mmWave, 5G, radar, and high-frequency applications, with impedance stability up to 70 GHz.
  • High-frequency characterization involves precise measurement techniques using S-parameters and impedance modeling.
  • PCB design plays a critical role in minimizing parasitic effects and enhancing resistor performance.
  • Mounting techniques are essential to ensure mechanical stability, especially for very small resistor packages.
  • AEC-Q200 compliant tests confirm the durability and performance consistency of the CHA series under harsh conditions.

Extended Summary

The CHA series resistors, manufactured by Vishay SA, are engineered for high-frequency applications, offering minimal internal reactance and operating effectively up to 70 GHz.

These resistors are available with gold and tin/silver terminations and cover a resistance range of 10 Ω to 500 Ω.

Understanding the behavior of resistors at such frequencies requires analyzing parasitic elements like inductance and capacitance, which are inherent due to construction and mounting.

The paper discusses the use of S-parameters and impedance characterization to simulate high-frequency performance accurately. The resistor, when mounted on a PCB, is modeled using a π-structure to account for parasitic effects. This structure aids in deriving impedance values from transmission admittance conversion after precise calibration.

Electrical Model Equivalent for HF Applications of CH / CHA thin film resistor

Where:
R is the nominal resistance value
L is the inductance linked to the resistor
C is the capacitance linked to the resistor
Lc is the parasitic inductance due to the resistor mounting
Cg is the parasitic capacitance due to the resistor mounting
Zo is the characteristic impedance of the line

High-frequency PCB design is another cornerstone of this study. The authors detail the selection of high-quality, low-loss substrates with stable dielectric properties suitable for frequencies above 40 GHz. Using a conductive-backed coplanar waveguide (CPWG) topology, the design minimizes discontinuities and optimizes impedance matching, crucial for maintaining performance up to 70 GHz. The use of TRL (thru-reflect-line) calibration techniques ensures measurement accuracy by negating the effects of cables, connectors, and other external influences.

Given the miniature size of the CHA 02016 package, assembly precision is critical to prevent issues like excessive tilting. Recommendations include specific stencil thicknesses, solder paste types, and thermal profiles to achieve optimal mounting.

The resistors underwent comprehensive AEC-Q200 tests, including high-temperature exposure, temperature cycling, biased humidity, operational life, mechanical shock, and vibration tests. The results showed exceptional stability, with minimal changes in impedance values before and after the tests. Frequency response measurements confirmed that the CHA series resistors maintained performance consistency even under extreme stress conditions, aligning closely with datasheet specifications.

Conclusion

The study demonstrates that Vishay’s CHA series thin film chip resistors offer outstanding high-frequency performance up to 70 GHz. Their robustness against environmental stresses, verified through rigorous AEC-Q200 tests, makes them reliable components for demanding applications in aerospace, military, automotive, and next-generation wireless technologies. The combination of precise measurement techniques, optimized PCB design, and meticulous assembly processes ensures these resistors deliver consistent, high-quality performance in real-world conditions.

Read the full paper:

CHA AECQ200-spcd5th_ed3Download

Related

Source: ESA SPCD

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
14

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

4.9.2026
4

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
7

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
9

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
22

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
16

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

1.9.2026
9

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

1.9.2026
39

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

31.8.2026
21

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved