Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Cybord Signed Partnership with Siemens to Adopt AI Based Inline PCBA Anti-Counterfeit & Traceability Monitoring System

15.9.2022
Reading Time: 2 mins read
A A

nt analytics software leader that implements AI & Big Data technology, announced it has signed a new original equipment manufacturer (OEM) partnership with Siemens Digital Industries Software, which will now offer the Cybord AI visual analytics solution. Cybord platform enables 100% analysis of all components placed on PCBA. The solution implements AI & Big Data technology to ensure productivity, quality, counterfeit, and unique visual traceability.

Cybord disrupts the industry by setting a new standard in component analytics and traceability. The company delivers advanced AI and Big Data software that visually analyzes, qualifies and tracks every component and every electronic board.

RelatedPosts

Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

The Cybord inline visual AI solution is being offered as part of Siemens’ manufacturing analytics solutions for electronic manufacturers. It can be integrated as part of a manufacturing execution system (MES) system or as a standalone solution.

“Our strong partnership with Siemens amplifies the value of Cybord’s platform and expands our market reach,” said Zeev Efrat, CEO of Cybord. “We are looking forward to working with Siemens to bring the power of our combined solution to electronics manufacturers across the industry.”

The unique advantage of the Cybord inline visual AI solution is that it uses SMT machines’ component imaging for visual verification and analyzes 100% of the electronic components at production before they are placed on the circuit board, without changing SMT throughput.

Cybord is available to the production line operators and electronic manufacturers, providing production data analytics and verification to all stakeholders.

Izik Avidan, Analytics Business Unit Manager, Digital Manufacturing, at Siemens Digital Industries Software, said: “The Cybord SaaS solution helps fill a key gap by providing electronics manufacturers with an accurate and scalable way to help confirm that all PCB components are authentic and with satisfactory quality. This is even more necessary today with many manufacturers being forced to source components from new or less-familiar suppliers due to the ongoing supply chain disruption.”

He continued: “With this solution, our customers can gain increased transparency over their components, enabling them to reduce risk through more comprehensive validation.”

read more about Cybord AI system here:

Related

Source: Cybord Traceability as a Productivity Tool

Recent Posts

ECIA January 2026 Reports Strong Sales Confidence

19.2.2026
25

MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

18.2.2026
184

2026 Power Magnetics Design Trends: Flyback, DAB and Planar

13.2.2026
47

Skeleton Technologies Expands in U.S. to Power AI Data Centers

9.2.2026
34

DigiKey Expands Line Card with 108K Stock Parts and 364 Suppliers

6.2.2026
18

Würth Elektronik Announces Partner Program

6.2.2026
43

Murata Opens New Ceramic Capacitor Manufacturing and R&D Center in Japan

5.2.2026
97

Mechanical Drift Indicator of Tantalum Capacitor Anodes Degradation under Reverse Bias

3.2.2026
50

Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

2.2.2026
43

Upcoming Events

Feb 24
16:00 - 17:00 CET

Mastering Galvanic Isolation: Ensuring Safety in Power Electronics

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version