Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Vishay Releases Sulfur‑Resistant Chip Resistors

    Würth Elektronik Introduces Lead-Free SMT Spacers

    Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A

    Empower Releases High-Density Embedded Silicon Capacitors

    TDK Unveils 125C Compact DC Link Film Capacitors

    SCHURTER Releases Coin Cell Supercapacitors for Backup Power

    Skeleton Technologies Expands in U.S. to Power AI Data Centers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Vishay Releases Sulfur‑Resistant Chip Resistors

    Würth Elektronik Introduces Lead-Free SMT Spacers

    Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A

    Empower Releases High-Density Embedded Silicon Capacitors

    TDK Unveils 125C Compact DC Link Film Capacitors

    SCHURTER Releases Coin Cell Supercapacitors for Backup Power

    Skeleton Technologies Expands in U.S. to Power AI Data Centers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Direct Coherent Multi-ink Printing of Fabric Supercapacitors

5.2.2021
Reading Time: 3 mins read
A A

Coaxial fiber-shaped supercapacitors with short charge carrier diffusion paths are highly desirable as high-performance energy storage devices for wearable electronics. However, the traditional approaches based on the multistep fabrication processes for constructing the fiber-shaped energy device still encounter persistent restrictions in fabrication procedure, scalability, and mechanical durability. To overcome this critical challenge, a team of scientists based in China, the U.S. and Singapore realized an all-in-one coaxial fiber-shaped asymmetric supercapacitor (FASC) device by a direct coherent multi-ink writing three-dimensional printing technology via designing the internal structure of the coaxial needles and regulating the rheological property and the feed rates of the multi-ink.

Benefitting from the compact coaxial structure, the FASC device delivers a superior areal energy/power density at a high mass loading, and outstanding mechanical stability. As a conceptual exhibition for system integration, the FASC device is integrated with mechanical units and pressure sensor to realize high-performance self-powered mechanical devices and monitoring systems, respectively.

RelatedPosts

TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

2026 Power Magnetics Design Trends: Flyback, DAB and Planar

Vishay Releases Sulfur‑Resistant Chip Resistors

Advanced fibrous energy storage devices with excellent knittability, flexibility and high mechanical stability allow the development of advanced textile-based wearable electronics. For this, Fibre-shaped Asymmetric Supercapacitors (FASCs) have been widely used in wearable electronics, which have high-power density, long cycling stability, good reversibility and energy density features.

Fig. 1 Diagrammatic drawing of the fabrication process of various FASC devices.Schematic diagram of the comparison of the preparation process of the conventional FASC device with (A) parallel, (B) twisted, (C and D) coaxial architectures, and (E) our development of three-dimensional (3D) printing coaxial FASC device via a direct coherent multi-ink writing (DCMW) technology.

However, they are not ideal for electron transfer and ion diffusion because of their larger spacing between two electrodes. Additionally, they have a massive volume structure, posing a serious challenge for the large-scale integration process. Although FASC with shorter charge carrier paths can improve device performance, they suffer from the separation of negative/positive electrodes when a device is bent.

To overcome the above challenges, a team of scientists based in China, the U.S. and Singapore has developed an all-in-one coaxial FASC device with compact internal structures using 3D printing direct ink writing technology. The asymmetric supercapacitors were obtained using different electrode inks/electrolytes since the traditional direct ink writing technology is based on single-ink printing, which can only write one electrode at one time.

Impressively, the device exhibited great flexibility with capacitance retention of 95.5 per cent after 5000 cycles of repetitive bending, which is better than traditional coaxial (87.1 per cent) or twisted (78.2 per cent) asymmetric supercapacitors.

To demonstrate the feasibility of powering electronic devices, a fully charged 3D printed coaxial FASC device in the shape of a dragon was used for illuminating a 1.5-V red LED. Moreover, two 3D printed coaxial FASC devices in series can illuminate a 3.0-V blue LED.

Self-powered systems with energy storage

To obtain a device with high energy density that can drive a mechanical unit, a chip-based FASC device was constructed by realising the 3D printed coaxial FASC device in series. The chip-based FASC devices charged by a solar cell were able to drive an electric motor for continuous rotation.

To test the endurance of a self-powered system, an electric car was actuated with and without the chip-based FASC devices. t resulted in the electric car with solar cell run a short distance because of the lack of external energy supply. In contrast, the electric car with the solar cell and the chip-based FASC devices ran a longer distance, demonstrating enhanced durability for future application in self-powered electric vehicles. Similarly, sightseeing cable cars with a self-powered system demonstrate faster running speed than that with solar cell only.

People usually monitor their health status using sensors, which need to be charged or replaced frequently. Therefore, the self-energy monitoring system can solve the aforementioned problem. To investigate the sensing capability of the pressure sensor, the pressure sensor was attached to the wrist and fingertip of an adult tester and the response signals were detected before and after exercise. The results depicted that both the big and small signals can be monitored, indicating excellent pressure-sensing performance. Thus, an all-in-one coaxial solid-state FASC device with high energy density will become a prospective candidate to be used in more new fields such as artificial intelligence, robotics and sensing.

Related

Source: ScienceMag

Recent Posts

TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

16.2.2026
4

Empower Releases High-Density Embedded Silicon Capacitors

11.2.2026
39

TDK Unveils 125C Compact DC Link Film Capacitors

11.2.2026
25

SCHURTER Releases Coin Cell Supercapacitors for Backup Power

10.2.2026
20

Skeleton Technologies Expands in U.S. to Power AI Data Centers

9.2.2026
25

TDK Releases Stackable µPOL 25A Power Modules

9.2.2026
24

Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage

6.2.2026
22

Murata Opens New Ceramic Capacitor Manufacturing and R&D Center in Japan

5.2.2026
87

Murata Publishes Power Delivery Guide for AI Servers

4.2.2026
117

Upcoming Events

Feb 24
16:00 - 17:00 CET

Mastering Galvanic Isolation: Ensuring Safety in Power Electronics

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version