Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard for Smart Homes in our webinar for manufacturers! Find out how Matter improves interoperability and what framework conditions need to be considered when using it. […]
Space and Military Standards for Hybrids and RF Microwave Modules Instructor: Thomas Green Description: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing and overwhelming to the inexperienced user. This course is designed to explain in a logical manner the quality and manufacturing requirements for building custom Class […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing process for the production of the module or the entire electronic assembly from the PCB to the end product? True to the motto “more than […]
MIL-STD-883 TM 2010 Instructor: Thomas Green Description: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll discuss the strategies for reducing your Bill of Materials (BoM) while enhancing Common Mode noise reduction. We will introduce a method to design compliant filters […]
Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review of the Mil Spec test methods in place to prevent moisture related failures in hermetically sealed microelectronics where functional reliability is of utmost importance (e.g. […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past, gold wire was the dominant material in use, but in 2015 copper and palladium coated copper wire captured more than 51% of […]
