Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

23.6.2026
Reading Time: 8 mins read
A A

Bourns has introduced the CDSOD323-TxxC-Q Series, an automotive‑grade bidirectional TVS diode family targeting ESD and surge protection on single high‑speed data lines and I/O ports in space‑constrained designs.

The TVS diode devices combine AEC‑Q101 automotive qualification, up to 30 kV ESD robustness and low capacitance in a compact SOD‑323 package, making them a practical alternative to larger multilayer varistors in modern automotive and consumer electronics.

RelatedPosts

Bourns Introduces Precision Thin Film Resistors for Measurement

Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

Key features and benefits

  • Bidirectional line protection – Single‑line TVS structure that clamps both positive and negative transient events on one data line or I/O pin, simplifying layout and BOM for differential and single‑ended interfaces.
  • High ESD robustness – Rated up to 30 kV according to IEC 61000‑4‑2, providing a wide protection margin for direct human‑body ESD events at external connectors, keypads, and exposed interfaces.
  • Low typical capacitance (≈ 3 pF) – Supports high‑speed signal integrity where added capacitance would otherwise degrade eye diagrams or increase rise times, for example on USB or other fast serial links.
  • Compact JEDEC SOD‑323 package – Small‑outline footprint supports dense PCB layouts in miniaturized ECUs and portable devices and fits standard pick‑and‑place and reflow processes.
  • AEC‑Q101 qualification – Automotive‑grade screening for higher reliability across temperature and operating life, important for in‑vehicle infotainment, telematics, and sensor ECUs.
  • Drop‑in MLV replacement option – Intended as a replacement for larger 0805 multilayer varistor components, helping engineers reduce footprint while maintaining or improving surge performance.
  • RoHS compliant – Meets Bourns environmental compliance definitions, easing use in global designs without extra material approval work.

Typical applications

Although the series is automotive‑qualified, Bourns positions CDSOD323‑TxxC‑Q also for compact consumer and portable devices where board space and ESD robustness are both critical.

  • Cellular phones and smartphones – Protection of audio jacks, buttons, RF control lines, side‑key interfaces, and baseband GPIOs exposed at connectors.
  • PDAs and notebook computers – Protection of docking interfaces, SD card lines, and low‑speed control buses near user‑accessible connectors.
  • Digital cameras, MP3 players and GPS devices – ESD protection on USB, memory card and accessory connectors in tightly packed enclosures.
  • USB interfaces – General‑purpose USB data line protection, especially where low line capacitance and small footprint are more important than multi‑line integration.
  • Automotive systems – Infotainment, telematics, body control, diagnostics connectors, and other automotive ECUs that require AEC‑Q101 components and compact protection for signal pins.

In practice, the devices are a good fit anywhere one or a few sensitive CMOS inputs are routed to a connector and cannot tolerate high parasitic capacitance or large discrete components close to the pins.

Technical highlights

The CDSOD323‑TxxC‑Q Series is a family of automotive‑grade TVS diodes; individual part numbers are differentiated mainly by their standoff and breakdown voltages, which must be chosen according to the interface signal levels. Exact voltage ratings, leakage specifications and clamp characteristics should be taken from the manufacturer datasheet.

Package and construction

  • Package: JEDEC SOD‑323 plastic package.
  • Polarity: Bidirectional configuration for protecting a single line in both polarities.
  • Intended replacement: 0805 multilayer varistor in many designs, with reduced PCB area.

Electrical characteristics (overview)

The precise numbers depend on the selected TxxC‑Q variant and are according to the manufacturer datasheet, but the family includes:

  • ESD capability: Up to 30 kV contact/air discharge (IEC 61000‑4‑2 test method).
  • Typical capacitance: Approximately 3 pF, suitable for many high‑speed and RF‑sensitive lines that cannot tolerate higher‑capacitance TVS devices.
  • Surge and EFT immunity: Designed to clamp surge and fast transient overvoltages on exposed signal lines.

Positioning versus multilayer varistors

Multilayer varistors in 0805 size are a common choice for single‑line ESD protection but consume more area and generally exhibit higher capacitance than a small‑signal TVS diode. Replacing an 0805 MLV with a CDSOD323‑TxxC‑Q device can:

  • Reduce PCB footprint and allow denser connector pin‑field routing.
  • Improve signal integrity where MLV capacitance was close to the limit for the interface.
  • Maintain or improve ESD robustness as long as the selected TVS variant provides adequate clamping for the system‑level requirements.

Summary table: key characteristics

ParameterCDSOD323-TxxC-Q family (overview)
Protection typeBidirectional TVS diode, single line
PackageSOD-323 (JEDEC)
ESD ratingUp to 30 kV (IEC 61000-4-2)
Typical capacitance≈ 3 pF (depending on type, see datasheet)
Automotive qualificationAEC-Q101 compliant
Intended MLV replacement0805 multilayer varistor in many signal-line applications

Design‑in notes for engineers

When designing in the CDSOD323‑TxxC‑Q TVS diodes, treat them as protection elements that must be selected and placed carefully relative to the protected IC and the external interface.

  • Choose the correct voltage variant – Select a TxxC‑Q type whose standoff voltage comfortably exceeds the maximum normal signal voltage, including tolerances, to avoid unwanted clamping during normal operation.
  • Check clamping voltage against IC ratings – Use the datasheet surge and ESD clamping curves to verify that the maximum voltage at the protected pin under worst‑case surge is below the absolute maximum rating of the interface device.
  • Place close to the connector – For best performance, place the SOD‑323 device as close as possible to the external connector or entry point and minimize the loop area between the TVS, connector pin and return path.
  • Provide a solid return path – Ensure a low‑impedance ground reference (wide trace or plane) from the TVS diode to the system ground so that surge current is shunted away efficiently.
  • Account for line capacitance – Although the typical capacitance is around 3 pF, high‑speed or RF interfaces may still require signal‑integrity simulation to confirm that the added capacitance is acceptable.
  • Compare against existing MLVs – When replacing an 0805 multilayer varistor, compare surge energy ratings, leakage, and clamping behavior to ensure that the new TVS meets or exceeds current protection performance.
  • Verify derating over temperature – For automotive environments, check the datasheet for any temperature dependencies in leakage current and clamping voltage across the full ECU temperature range.

Example use in an automotive ECU

A common use case is an automotive infotainment ECU where USB and auxiliary connectors are routed to a central SoC or USB hub:

  • Use one CDSOD323‑TxxC‑Q device per differential pair line, placed adjacent to the connector footprints.
  • Route short traces from the connector pins to the TVS pads and then to the main signal routes, avoiding long stubs.
  • Tie the TVS return to the local chassis or digital ground reference near the connector to minimize common‑mode coupling into the rest of the system.

Source

This article is based on information provided in the official Bourns press release and associated product documentation for the CDSOD323‑TxxC‑Q automotive‑grade TVS diode series, with additional independent commentary for design engineers and component buyers.

References

  1. Bourns press release – Bourns Introduces CDSOD323-TxxC-Q Automotive-Grade TVS Diode Series for Compact ESD Protection
  2. Bourns CDSOD323-TxxC-Q Series – Product datasheet
  3. Bourns – Official website

Meta description:
SEO title: Bourns CDSOD323-TxxC-Q Automotive TVS Diode Series
Tags: Bourns, TVS diode, ESD protection, automotive electronics, AEC-Q101, transient voltage suppressor, multilayer varistor replacement, SOD-323, circuit protection, signal integrity

Featured image prompt: Close-up macro of a tiny SOD-323 TVS diode on a green automotive ECU PCB with visible fine signal traces, clean engineering style, abstract blue tech background with subtle ESD waveform overlay, sharp studio lighting with soft reflections on the package edges.

Related

Recent Posts

Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

12.11.2026
4

Bourns Releases 450 V DC Bus TVS Diode

10.11.2026
3
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
20
Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

Bourns Releases Power Resistor Adds Reverse-Pin Configuration

3.11.2026
11
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
42
TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

29.10.2026
37

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
60

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

28.10.2026
81
Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

27.10.2026
32

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved