Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools November 4, 2025 | 10:00 AM PST This webinar will present advanced simulation tools and techniques for the […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
Self-healing polymer materials for the next generation of high-temperature power capacitors Thursday, 6 November 2025, 14:30-16:00 (CET), M304-M307, Alsion, SDU Sønderborg with online join option for registered attendees. About the […]
Industrial Applications Demand More from Interconnects in Next-Gen Designs by Samtec Tuesday, November 11, 2025 · 5:00 p.m. CET Need to specify interconnects for industrial applications like automation, robotics, embedded […]
Würth Elektronik Webinar: Impedance is for everyone! Wed, Nov 12, 2025 11:00 AM - 12:00 PM CET As data rates increase, so do the demands on PCB design. To ensure […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical […]
Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different […]
Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization Webinar by Würth Elektronik Wednesday, December 10th 2025 @ 4:00PM CET Curious about Qi2 wireless power design? Join this webinar […]
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