Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

IIT Hyderabad Researchers Use Corn Husk to Produce Carbon Electrode for Supercapacitors

30.7.2020
Reading Time: 3 mins read
A A

Hyderabad: Indian Institute of Technology Hyderabad Researchers have developed a simple and cost-effective method to derive ‘activated carbon electrode’ material from cornhusk for high-voltage supercapacitors. Their electrode showed better electrochemical performance (High energy density and high-power density) when compared with conventional supercapacitors.

This development is important for India, especially for States such as Uttar Pradesh and the combined Andhra Pradesh-Telangana States, which are the first and second largest producers of corn in the country respectively. They produce a large amount of cornhusk waste, much of which waste is currently burnt as its potential to be converted to valuable electrode material is not harnessed owing to lack of awareness, expertise and technology.

RelatedPosts

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

This Research by IIT Hyderabad on affordable and efficient methods can enable this conversion, which would trigger the cascade of additional earning opportunity for the corn-farmer and provision of a sustainable energy source.

The research was led by Dr. Atul Suresh Deshpande, Associate Professor, Department of Materials Science and Metallurgical Engineering, IIT Hyderabad, in collaboration with Dr. T. N. Rao, Associate Director, International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI), Hyderabad, along with their Research students, M. Usha Rani, and K. Nanaji (Project Scientist). Their Research paper detailing the synthesis procedure and the electrochemical performance of the material produced has been recently published in the reputed peer-reviewed Journal of Power Sources.

In the global sector, rapid advancements in adopting new technology and fast evolving green energy systems are trending in the supercapacitor’s market. It is projected to share USD 720 million by 2025 market value, which is expected to grow at a CAGR of 12 per cent from 2020 to 2025.

Carbon based electrodes are playing a crucial role in the development of energy storage devices. Carbon based electrodes are typically derived from expensive, high purity precursors such as polymers, organic precursors, high purity gases using various methods. The production of carbon electrodes from biomass is a simpler straightforward process.

In collaboration with ARCI (Hyderabad), the IIT Hyderabad team has developed activated carbon electrode using simple materials – Corn husk and KOH.

Explaining his research, Dr. Atul Suresh Deshpande, Associate Professor, Department of Materials Science and Metallurgical Engineering, IIT Hyderabad, said, “Activated carbon electrode material with porous sheet-like morphology has been prepared using corn husk through carbonization followed by KOH activation. Due to the low-cost precursors and simple processing method, this process of producing activated carbon can be easily adapted for large-scale commercial production.”

To obtain the high surface area activated carbon with porous sheet-like morphology from corn husk, the researchers added KOH as an activating agent. KOH helps in the formation of sheet-like morphology. The synergy of morphology and high specific surface area (1378 m2 g-1) improve the storage capacity of the activated carbon electrode material.

The storage capability of activated carbon sample tested by using high-operating voltage electrolyte (1M tetraethylammonium tetrafluoroborate (TEABF4) in acetonitrile (AN)). This electrode showed better electrochemical performance (High energy density (20 Wh kg-1) and high-power density (681 W kg-1) at 1 A g-1) than electrodes in conventional supercapacitors.

Explaining further, Dr. T. N. Rao, Associate Director, International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI), Hyderabad, added, “Activated carbon derived from natural sources is very promising electrode material for supercapacitors, and the well-known Maxwell company uses coconut derived activated carbon in their supercapacitors. The key scientific challenge in this research is pore size engineering of activated carbon with high surface area and suitable pore size that allows the electrolyte ions to adsorb into pores to maximum extent which in turn give high capacity. The group at IITH in collaboration with ARCI has succeeded in converting corn husk into high performing activated carbon for supercapacitor application. Corn husk being widely produced waste, it is also scalable from technology point as well.”

Related

Source: India Education Diary

Recent Posts

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
20

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
12

Emerging Capacitor Markets in Fusion Energy

10.9.2026
29
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
59
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
11
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
20

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
45

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
42

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
69

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved