Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

October 2025 Interconnect, Passives and Electromechanical Components Market Insights

27.10.2025
Reading Time: 5 mins read
A A

Edgewater researchers report that AI remains robust while CPC extends the copper life cycle, non-AI markets continue on a more muted recovery

This October 2025 collection of news summaries, survey results, and channel market insights, covers Interconnect, Passives, and Electromechanical Components from Edgewater Research. 

RelatedPosts

Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

What’s Changed/What’s New?

The demand for copper remains moderately positive, with the third-quarter demand finishing in line with slightly better-than-expected figures. The demand for AI is still robust, with a positive outlook for the third quarter and sustained growth in volumes and content, particularly in interconnect, power, and cooling.

TE has a clear understanding of the situation and expects to ramp up as a second source for Nvidia NVL backplane by March 2026.

Top Three Channel Comments:

  1. The rule of copper is still valid, as CPC allows users to continue using copper with higher speeds, improved loss insertion, and longer reach. Customers want to continue using copper inside the rack, and CPC enables them to do so. They may find creative ways to use copper for scaling up even for two adjacent racks.
  2. Eventually, the industry will have to move to CPO for scaling up, which will be driven by the need for higher speeds and lane requirements. However, before that, CPC can serve as an intermediate step, supporting 448G and up to 1000 lanes.
  3. We continue to see many new design wins with China Auto OEMs. Local suppliers are trying to establish themselves, but most of the competition still comes from global IP and E suppliers. We see significant potential for content growth in China, driven by increasing levels and penetration of ADAS and the need for high-speed cables connecting compute power, cameras, and sensors.

Other Key Takeaways:

  • The medium-term AI outlook is better, as CPC and active cables are expected to extend copper’s viability into 448G, delaying the transition to optics or CPO.
  • CY25 Nvidia NVL rack shipments are expected to be biased towards the lower end of the previous forecast of 25-27K. Some component shipments are still tracking to 50-55K rack equivalents, creating digestion risk, although the timing remains unclear given the lack of signs of a near-term slowdown.
  • The power interconnect content in IT datacom is expected to rise sharply, potentially reaching around $10K per in the next-generation racks.
  • The demand for AWS Trainium is mixed. The second half of 2025 is still robust, but the demand in 2026 is volatile due to noise surrounding potential Trn3 adjustments.
  • Conservative projections suggest that the rack market will reach approximately 50,000 units by 2026. Amphenol is actively pursuing the acquisition of a second sourcing partner for Trn backplane cables, with the intention of starting this process in the second half of 2025.
  • The adoption of AEC standards is expected to accelerate as the industry transitions to a 1.6 Tb/s scale-out architecture. Microsoft, Meta, and Amazon are anticipated to qualify as secondary sources by utilizing Marvel DSPs. Meanwhile, Avago’s participation in the market is expected to increase significantly in 2026.
  • The auto market is experiencing stable M/M growth, with Asia leading the way. Europe’s growth is considered more subdued, while North America’s performance is better than anticipated so far this year. However, there are concerns about potential downside revisions in the market.
  • China’s automotive market continues to grow, driven by the increasing penetration of ADAS technology, which is contributing to a mid-single-digit component content growth per vehicle.
  • Western suppliers are consistently winning new design contracts at a rapid pace, particularly for critical safety applications such as ADAS, with Chinese OEMs playing a significant role in this trend.
  • The demand for automotive products in the Americas is improving this year, driven by the positive outlook for electric vehicles (EVs) due to the expiration of credits and the discipline exhibited by OEMs in pricing. However, the outlook for 2026 remains uncertain, with the potential for downside revisions in scaled-back EV incentives and the possibility of OEM tariff pass-through.
  • TE is planning to move certain direct automotive customers in the Americas to distribution on customer request to improve their terms of business.
  • The industrial market presents mixed readings. Demand in North America is improving, but it varies across different submarkets. Europe’s recovery is considered muted, and it is expected to continue into early 2026.
  • The medical and energy markets are experiencing strengthening demand. TE is benefiting from key medical programs and leveraging Richards’ integration to capture datacenter-driven power infrastructure content, while also improving its execution of ADM (Automotive Design Management).
  • The inventory levels for IP&E (Infrared, Photonics, and Electronics) are considered normal. However, channel replenishment is seen to be pausing, particularly in Europe. Pricing is generally considered typical, except for interconnect, where select suppliers are passing on another increase in distribution costs. Lead times are stable, except for certain AI-related passives.

Conclusion

the fundamentals of the IP&E segment remain positive as we exit the third quarter of the year. This positive outlook is primarily driven by the strength in the AI market and the steady recovery across non-AI markets. Overall, the segment continues to outperform semiconductors, benefiting from more tangible AI-driven content gains and healthier non-AI inventory.

Levels—supporting earlier recoveries in Industrial, Medical, and other end markets. Although non-AI momentum remains uneven, we remain optimistic about the fundamentals of 2026, barring any significant deterioration in demand due to inflation or tariff-driven cost pass-throughs. Our forecast for mid-single-digit year-over-year growth in 2026 remains unchanged.

Full report available from: Dennis Reed, Sr. Research Analyst, Edgewater Research

Related

Source: Edgewater Research

Recent Posts

Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
58
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
14
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
52
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
10
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
58
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
39
DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

1.10.2026
10
Sep 2026 electronics market heat map

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

30.9.2026
89
TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

29.9.2026
143

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved