Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
Reading Time: 4 mins read
A A


Bartosz Gackowski at col from SDU University in Denmark published their paper “Enhancing energy density in thin-film nanocomposite dielectric capacitors through surface functionalization of nanoparticles” in Energy Conversion and Management: X Journal.

Introduction

Thin-film dielectric capacitors are essential components in modern power electronics, offering high-frequency stability and rapid charge-discharge capabilities. However, their energy density remains constrained by the intrinsic properties of polymer dielectrics such as polypropylene (PP) used in film capacitors.

RelatedPosts

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

TDK X Series SMD Varistors for Industrial Transient Protection

This article explores a novel approach to enhancing energy density through surface functionalization of barium titanate nanoparticles (BTNs), integrated into PP matrices using a gel-based spin-coating method. Barium titanate is a common ferroelectric dielectric material used by class II MLCC ceramic capacitors.

Key Points

  • Functionalization of BTNs significantly improves dielectric constant and breakdown strength.
  • Surface treatments include hydroxylation, organic modifiers, polymer coating, and grafting.
  • Energy density increased by up to 308% compared to untreated BTN composites.
  • Polymer coating and grafting yielded the highest dielectric strength and energy density.
  • Applications span electric vehicles, grid storage, and high-voltage converters.

Extended Summary

Chapter 1: Materials and Functionalization Techniques

BTNs were treated using four distinct methods: hydroxylation (H2O2 or HNO3), organic surface agents (dopamine, silane, phosphorous acid, etc.), polymer coating with PP, and grafting with PPgMA. These treatments aimed to improve nanoparticle dispersion, reduce agglomeration, and tailor interfacial properties for enhanced dielectric performance.

Chapter 2: Fabrication of Nanocomposite Capacitors

Functionalized BTNs were dispersed in a PP gel and spin-coated onto silver-coated glass substrates. A layered structure was employed to mitigate short-circuit risks from agglomerates. Aluminium top electrodes were deposited to complete the capacitor structure. Dielectric thicknesses remained below 1 µm, ensuring compact device profiles.

Chapter 3: Chemical and Structural Analysis

XPS and EDX analyses confirmed successful surface modification, with increased oxygen and carbon content correlating to improved dispersion and interfacial bonding. Dopamine-treated BTNs exhibited the highest carbon concentration, indicating robust surface coverage. FTIR spectra revealed functional group incorporation, supporting the chemical bonding hypotheses.

Chapter 4: Dispersion and Agglomeration Control

Dynamic Light Scattering (DLS) showed that hydroxylation reduced particle size and agglomeration. Polymer-coated and grafted nanoparticles exhibited increased hydrodynamic diameters, suggesting shell formation. Proper dispersion was critical for maintaining high breakdown strength and uniform electric field distribution.

Chapter 5: Dielectric Performance Metrics

Capacitance, dielectric constant, and breakdown strength were measured across all samples. Devices with maleic anhydride and dopamine-modified BTNs showed up to 47% increase in capacitance. Polymer-coated BTNs achieved the highest breakdown strength (108% improvement), resulting in energy densities up to 5.2 J/cm3.

SampleDielectric Constant (εr)Breakdown Strength (MV/m)Energy Density (J/cm3)
Neat PP2.07001.3
BTN + Maleic Anhydride3.813772.4
BTN + Dopamine3.54122.0
BTN + PP Coating3.16085.2
BTN + PPgMA Grafting2.94803.1

Chapter 6: Applications in Power Electronics

Enhanced nanocomposite capacitors are ideal for high-voltage converters, electric vehicles, and grid storage systems. Their compact size and high energy density support integration with wide-bandgap semiconductors (SiC, GaN), enabling efficient, lightweight designs. Hybrid capacitor systems combining electrolytic and film capacitors benefit from improved ripple current handling and extended lifespan.

Conclusion

This study demonstrates that surface functionalization of BTNs is a critical strategy for improving the energy density of PP-based nanocomposite capacitors. Among the tested methods, polymer coating and grafting yielded the most significant performance gains. These findings pave the way for next-generation capacitors in high-efficiency power electronics, offering reduced size, weight, and enhanced reliability.

Read the full article at the link:

Bartosz Mikolaj Gackowski, Mohit Sharma, Alexandru Valuta, Thomas Ebel, William Greenbank,
Enhancing energy density in thin-film nanocomposite dielectric capacitors through surface functionalization of nanoparticles,
Energy Conversion and Management: X, Volume 28, 2025, 101260, ISSN 2590-1745,
https://doi.org/10.1016/j.ecmx.2025.101260.
(https://www.sciencedirect.com/science/article/pii/S2590174525003927)

Related

Source: ScienceDirect

Recent Posts

Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
29
TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
8
Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

13.10.2026
17
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
73
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
26
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
10
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
13
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
55
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
59

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved