Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Korean Electronics Component Manufacturers Optimistic about Market Recovery due to AI Demand

10.3.2025
Reading Time: 2 mins read
A A

South Korean electronics component manufacturers are recovering from the global IT slowdown by focusing on high-value products powered by artificial intelligence (AI) technology, as reported in an article published by Korea Bizwire.

LG Innotek and Samsung Electro-Mechanics, despite facing profitability challenges last year and achieving record sales, are now poised for a substantial turnaround.

RelatedPosts

Samsung Electro-Mechanics Releases 470nF 16V MLCC in 0402 Size

Samsung Electro-Mechanics Unveils Ultra-High-Capacitance MLCCs for AI Servers

Samsung MLCCs Lineup for In-Vehicle Infotainment

Market consensus compiled by Yonhap Infomax predicts LG Innotek’s Q1 2025 operating profit to be 98.6 billion won, a 43.9% decline from the same period last year. However, analysts are increasingly optimistic about the company’s prospects.

Daishin Securities forecasts LG Innotek’s Q1 operating profit to surpass market expectations, reaching 131.8 billion won. The securities firm has also raised its annual operating profit forecast by 8.1% to 740.5 billion won, representing a 4.9% increase from last year.

This positive outlook is partly driven by strong sales of Apple’s iPhone 16 Pro and Pro Max models, which feature LG Innotek’s high-end camera modules. Beyond its established partnership with Apple, the company is expanding its automotive components business, focusing on autonomous driving technologies such as sensing, communication, and lighting systems.

LG Innotek has also commenced mass production of FC-BGA (flip chip ball grid array) substrates for high-performance computing, securing recent supply agreements with prominent global tech companies. Analyst Park Kang-ho of Daishin Securities anticipates increased sales of FC-BGA, particularly for CPU and AI semiconductors, in the second half of the year, with potential high-value product supply to Intel.

Similarly, Samsung Electro-Mechanics is expected to deliver robust first-quarter results, with consensus forecasting operating profits of 197.8 billion won, a 10% year-on-year and 72% quarter-on-quarter increase. The company’s annual operating profit is projected to reach 735 billion won, representing a 24.5% rise from last year.

Samsung Electro-Mechanics, a subsidiary of Samsung, is poised to capitalize on China’s consumer stimulus program, which is anticipated to stimulate sales of smartphones and tablet PCs. To capitalize on this opportunity, the company is bolstering its product portfolio with high-value offerings, including multilayer ceramic capacitors (MLCCs) for AI servers and automotive applications, package substrates, and camera modules.

Mirae Asset Securities projects a steady increase in the utilization rate of Samsung Electro-Mechanics’ MLCC facility, from 83% in Q1 to 90% in Q3, driven by the surging demand for MLCCs in AI servers. Additionally, the company plans to commence mass production of FC-BGA (Flat-Chip Ball Grid Array) for AI accelerators within the coming year.

“Samsung Electro-Mechanics continues to increase its proportion of high-value products, leveraging its capability to meet server and automotive sector demands directly related to AI,” said Park Hee-chul, an analyst at Heungkuk Securities. “We expect steady growth in high-end FC-BGA demand and significant revenue contribution from AI accelerator-related products starting this year.”

Related

Source: Korea Bizwire

Recent Posts

Molex Acquires Smiths Interconnect

21.10.2025
1

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
2

September 2025 ECIA US Components Sales Sentiment Continues in Optimism

20.10.2025
11

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
25

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

14.10.2025
38

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

10.10.2025
66

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
36

Advances in the Environmental Performance of Polymer Capacitors

8.10.2025
66

Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

8.10.2025
31

Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

8.10.2025
17

Upcoming Events

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version