Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Novel Conductive Polymer that Does Not Require Any Doping to Conduct Electricity

10.3.2020
Reading Time: 3 mins read
A A

A research group led by Simone Fabiano at the Laboratory of Organic Electronics, Linköping University has created an organic material with superb conductivity that doesn’t need to be doped. They have achieved this by mixing two polymers with different properties. 

In order to increase the conductivity of polymers, and in this way obtain higher efficiency in organic solar cells, light-emitting diodes and other bioelectronic applications, researchers have until now doped the material with various substances. Typically, this is done by either removing an electron or donating it to the semiconductor material with a dopant molecule, a strategy that increases the number of charges and thereby the conductivity of the material.

RelatedPosts

Bourns Extends 1216 Kelvin Current Sense Resistors

Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

Samsung Low-Profile and Embedded MLCCs for Compact Devices

“We normally dope our organic polymers to improve their conductivity and the device performance. The process is stable for a while, but the material degenerates and the substances we use as doping agents can eventually leach out. This is something that we want to avoid at any cost in, for example, bioelectronic applications, where the organic electronic components can give huge benefits in wearable electronics and as implants in the body”, says Associate Professor Simone Fabiano, head of the Organic Nanoelectronics group within the Laboratory of Organic Electronics at Linköping University.

A perfect match

The research group, with scientists from five countries, has now succeeded in combining the two polymers, producing a conducting ink that does not require any doping to conduct electricity. The energy levels of the two materials perfectly match, such that charges are spontaneously transferred from one polymer to the other.

The phenomenon of spontaneous charge transfer has been demonstrated before, but only for single crystals on a laboratory scale. No one has shown anything that could be used at an industrial scale. Polymers consist of large and stable molecules that are easy to deposit from solution, and that’s why they are well suited for large-scale use as ink in printed electronics”, says Simone Fabiano.

Polymers are simple and relatively cheap materials, and are commercially available. No foreign substances leach out from the new polymer mixture. It remains stable for a long time and withstands high temperatures. These properties are important for energy harvesting/storage devices as well as wearable electronics.

“Since they are free of doping agents, they are stable over time and can be used in demanding applications. The discovery of this phenomenon opens completely new possibilities for improving the performance of light-emitting diodes, solar cells and other electronic components. This is also the case for other thermoelectric applications, and not least for research within wearable and close-body electronics”, says Simone Fabiano.

A major new chapter in the field

“We have involved scientists at Linköping University and Chalmers University of Technology, and experts in the US, Germany, Japan, and China. It has been a really great experience to lead this work, which is a large and important step in the field”, he says.

Principal funding for the research has come from the Swedish Research Council and the Wallenberg Wood Science Center. It has also been conducted within the framework for the strategic initiative in advanced functional materials, AFM, at Linköping University.

“Fundamentally, doping in conducting polymers, generating high electrical conductivity, has so far only been achieved by combining a non-conducting dopant with a conducting polymer. Now, for the first time, the combination of two conducting polymers renders a composite system that is highly stable and highly conducting. This discovery defines a major new chapter in the field of conducting polymers, and will spark many novel applications and interest world-wide”, says professor Magnus Berggren, director of Laboratory of Organic Electronics at Linköping University.

Nature Materials 2020, doi 10.1038/s41563-020-0618-7

featured image source: Linköping University

Related

Source: Linköping University

Recent Posts

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
33
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
27

Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

14.7.2026
124

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

8.7.2026
234

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
79

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
145

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
111

Molecular Memristor Shows Record 145 kH Emergent Inductance

12.5.2026
82

Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

11.5.2026
161

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Ohm’s Law Answers Your Questions

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved