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    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

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    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

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    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

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    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

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    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

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    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

    Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

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Permanent Connections to Printed Circuit Boards

9.9.2021
Reading Time: 1 min read
A A

The literature on Printed Circuit Boards (PCB) is extensive and details on the design and manufacture of PCBs are outside the scope of this text.

A brief description of a multilayer PCB will be followed by a discussion of the components of a PCB that are most relevant to making permanent connections, mechanical and soldered, to a PCB and how those components impact on PCB and connector materials and design.

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For mechanical permanent connections the focus will be on compliant press-in connection materials and design. With respect to the PCB this will require consideration of Plated Through Hole (PTH) manufacturing. For soldered connections the focus will be on PCB land/pad and connector contact solderability considerations, for both wave soldering and Surface Mount Technology (SMT). From the connector perspective, additional discussion of some of the key connector contact lead design issues as they apply to SMT applications will be necessary.

Related

Source: Wurth elektronik

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