Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Reliability and Sustainability of Passive Components; PCNS Theme Interview with TPC Members; #6 Thomas Ebel, SDU University of Southern Denmark

11.3.2021
Reading Time: 5 mins read
A A

TPC Technical Program Committee of the next 3rd PCNS Passive Components Networking Symposium scheduled for Sep 7-10th 2021 in Milano, Italy selected theme of the symposium: RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS that will be elaborated in conference Workshop, Hot Topic Panel Discussion, Keynote and papers selection preferences. EPCI, the main PCNS organizer, questioned TPC members why they consider the theme so important for today’s passive electronic components and what shall be discussed within this topic in depth. The next interview #6 is with TPC academic member, Associate Professor, Dr. Thomas Ebel (TE), Head of SDU Electrical Engineering and Head of Centre for Industrial Electronics (CIE) at Department of Mechanical and Electrical Engineering, SDU University of Southern Denmark.

EPCI: What ideas, issues, concerns, directions has raised on your mind when TPC selected „Reliability & Sustainability of Passive Components“ as the 3rd PCNS theme ?

RelatedPosts

Bourns Releases Compact High Current Shielded Power Inductors

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

TE: Sustainable electronics is one of the key disciplines for saving the planet.

Power electronics (including many passive components)  will help to reduce massively the CO2 emission, e.g. application in  renewable energy generation, transmission,  industry electronics, medical application, transportation but also in the urban or even agricultural sector.

According to my option we need in the future a more sustainable way to deal with electronics, especially with passive components. The mentioned electrification process of the society will strongly accelerate and therefore dramatically increase the use of passive components. However, the recourses of the planet are limited .

Therefore, I believe we need a different way to think about passive components design. The selection of the right technologies, materials and also taking into consideration the end of lifetime of the component, by pre-designing recycling processes, will improve the overall sustainability of the use.

Another aspect is the reliability of the electronic system. The utilization of  intelligent condition monitoring and control processes will also help to extend the life time of the existing parts in a more efficient way.

At the end this will all help to create prosper business development which is in line with nature.

EPCI: What topic you would recommend for the Hot Panel Discussion and Why ?

TE: Sustainability, most important for climate protection and future business development. 

EPCI: You are working for SDU as Head of Electrical Engineering. Can you comment what is Hot / Upcoming relevant to the PCNS theme ?

TE: I am keen to see new developments in the field of material development but also new ideas how to simplify and conduct condition monitoring of passive components.

EPCI: How is your university going to address this topic during PCNS ?

TE: SDU, as one of few universities in Europe, is going to put focus primary on passive components research because it is necessary to develop the passive counterpart related to the strong activities in active component research, like e.g. the new wide band gap semiconductor power devices

We support PCNS with organizational help and paper submission.

EPCI: Thank you Thomas and lets hope in best that we can meet live at PCNS in Milano in September

Associate Professor, Dr. Thomas Ebel can be reached at his Linked In profile


see more about PCNS on its website:

PCNS website

be active in passives ! join us and submit your paper abstract online:

Call for Papers Announced ! Abstract Deadline April 2nd 2021

About

PCNS Passive Components Networking Symposium is a bi-annual international symposium organized by EPCI European Passive Components Institute in co-operation with an European university. 3rd edition of the PCNS Passive Components Networking Days Symposium scheduled for September 7-10th, 2021 in Milano, Italy is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information and Bioengineering of Politecnico di Milano. It is intended as a live event with speakers present with streaming options for virtual attendees. In worst case, the PCNS will move to virtual event; all registered attendees will get hard printed ISBN Proceedings (by mail post in virtual case).

Associate Professor, Dr. Thomas Ebel

  • Since August 2018 Associate Professor, Head of the Section Electrical Engineering (Campus Sønderborg and Odense) and Head of Centre for Industrial Electronics (CIE) in Sønderborg of the University of Southern Denmark (SDU).
  • September 2008 to July 2018 Managing director and shareholder before for a short time R&D Director at FTCAP GmbH, Husum, Manufacturer of Aluminum Electrolytic and Film- Capacitors
  • October 2001-July 2008 R&D Director, later Technical Director (CTO), Member of board of directors Becromal Norway at Becromal S.p.A, since 10/2008 Epcos/TDK, Milano, Italy, Manufacturer of foils for Aluminum-Electrolytic- Capacitors with former production sites in Norway, Island and USA
  • August 1995-September 2001 R&D Engineer later R&D Director Siemens Matsushita Components, Siemens AG PR, since 10/1999 EPCOS AG, since 10/2008 TDK, Business unit capacitors, Aluminum- Electrolytic- Capacitors, Heidenheim, Germany
  • October 1987-June 1995 Westfälische Wilhelms-University of Münster, Germany Dr. rer. nat. at Prof. Wolfgang Jeitschko in Solid state Chemistry

Related

Source: EPCI

Recent Posts

Bourns Releases Compact High Current Shielded Power Inductors

2.4.2026
9

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
28

APEC 2026 Power Electronics Trends and Implications for Passive Components

1.4.2026
45

Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

1.4.2026
23

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
34

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

30.3.2026
73

Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

27.3.2026
33

New J‑STD‑075B Standard Elevates Process Sensitivity Classification for Passive and Solid-State Components

27.3.2026
44

Modelithics Expands COMPLETE+3D Library for Ansys HFSS

27.3.2026
9

Upcoming Events

Apr 8
17:00 - 18:00 CEST

Trade Secrets of the Flyback Converter

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version