Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

    SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics

    TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

    Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

    Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

    Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

    YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

    SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics

    TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

    Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

    Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

    Hirose Releases Ultra‑low Profile FPC‑to‑board Connector

    YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Taiwanese MLCC Manufacturers to Benefit as Murata Optimistic about AI Boom

8.8.2024
Reading Time: 2 mins read
A A

According to a report from Economic Daily News, the AI boom has significantly increased the use of passive components, particularly in AI PCs and AI servers. Murata, a Japanese giant in multilayer ceramic capacitors (MLCC), is optimistic about the market outlook, stating that AI is driving waves of MLCC demand.

As per a report from Nikkei, Murata President Norio Nakajima revealed in an interview that the AI trend is unstoppable, leading to an expansion in MLCC applications.

RelatedPosts

YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering

Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors

Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

This expansion reportedly starts with smartphones and extends to edge AI in computers equipped with generative AI functions. The end-use of these devices will drive an increase in MLCC consumption, and the demand for components in AI servers is also ramping up.

Murata’s views on the passive component market are referable, as in the first half of this year, Murata was ahead of the industry in announcing a recovery in component shipments for the smartphone market and an increase in capacity utilization at its MLCC plants.

Norio Nakajima pointed out that as demand surges, the capacity utilization rate of Murata’s MLCC plants has been continuously increasing to meet end-user demand. Last quarter, the capacity utilization rate was approximately 80% to 85%, and this quarter it is expected to rise to 85% to 90%.

Following Murata, Taiwanese companies such as Yageo and Walsin Technology also saw a recovery in their operations, marking the beginning of a bullish phase for the passive component market.

Industry sources cited by Economic Daily News further explain that Murata’s optimistic outlook is well-founded. The average MLCC usage per AI PC has surged by about 80% compared to traditional PCs, while the usage in AI servers has more than doubled, with each server requiring an average of 3,000 to 4,000 MLCCs.

In high-speed computing environments, this will further drive the demand for high-capacity and high-voltage MLCCs. Meanwhile, Yageo and Walsin Technology are actively seizing the business opportunities brought by AI.

Yageo Chairman Pierre Chen once stated that at this stage, the group not only provides MLCCs and chip resistors for AI applications but also inductors and magnetic components.

These offerings include both standard and niche products, and the company can also provide customized product combinations according to customers’ requirements for high-temperature and high-current tolerance.

Related

Source: Trendforce

Recent Posts

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

19.6.2026
8

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

18.6.2026
33

Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

17.6.2026
24

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

17.6.2026
25

Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

17.6.2026
38

YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering

16.6.2026
30

DMASS: European Components Distribution Returns To Growth In Q1 2026

16.6.2026
32

German Component Distribution Market Rebounds in Q1 2026 According to FBDi

16.6.2026
29

Nippon Chemi-Con Announces New Capacitor series for AI, Automotive and Immersion Cooling

16.6.2026
51

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version