source: Thales Alenia Space ; ESA SPCD 2018 Symposium
EPCI e-symposium library article
Thales Alenia Space presented its passive component roadmap during the ESA SPCD 2018 symposium at ESA ESTEC
published by EPCI under approval of ESA SPCD 2018 organizing committee.
Title: TAS Roadmap Passive Components
Author(s): Myriam Boyer (1), Teva Ihorai (1), Dominique Ducasse (1)
Organisation(s): (1) Thales Alenia Space, 26 Avenue Jean François Champollion, 31100 Toulouse, France
Symposium: ESA SPCD 2018
Reference: Technology Roadmaps.
ISBN: N/A
e-Sessions Applications: Aerospace
e-Sessions Scope Components: Capacitors, Resistors, Inductors, RF passives
e-Sessions Topics: Roadmaps
Common requirements for passive parts
Main requirements coming from Equipment & Payload Road Map:
- Equipment/ Payload/ design flexibility
- Higher density & integrated solutions
- Increase of dissipated power & operating temperature
- Cost & lead time reductions
- To promote collaboration with European Suppliers
Capacitors & Resistors
2019 – 2020
- Chip size reduction0302 / 0402
- New technology on Board or Hybrid Line
- Polymer Tantalum (SnPb or Gold terminations)
- Grade 2 / COTS introduction :
⇒Known space manufacturers : lighten
⇒Automotive suppliers : Evaluation / JD Construction - Upgrading solutions analyzed
- Introduction of COTS solutions for specific applications
Higher density & more integrated solutions needed towards:
2021 – 2023
- Chip size reduction to 0201
- Automatic Process suitable with Pure Tin Terminations components
- Extended Temperature range to 175°C
- Miniaturize actual Film / Tantalum capacitors
- Extend Rated power on resistors with smaller size
- Components Cohabitation = COTS / Grade 1
Magnetics
2019 – 2020
- Components designed to be flexible with stable performances
- Components designed to be compliant with automatic assembly processes
- Magnetics solutions with small tuning operation time and wide range of customization (planar, RM, toroid…)
- Standard series with limited range of customization
- SMD solutions preferred / small size / reduced manufacturing lead time
- Introduction of COTS solutions for specific applications
Increase of dissipated power & operating temperature, higher density & more integrated solutions, cost & LT reduction needed towards:
2021 – 2023
- Magnetics with no tuning operation
- Standard series with wide range of customization
- New materials compliant to operating temperature (core, ferrite, coil former, glue resin…)
- Cost and manufacturing lead time optimization
Crystals & Oscillators
2019 -2020
- Components designed to have a high frequencystability
- Components designed to be compliant with Space environment:
- Vacuum
- Mechanical environment
- Thermal environment
- OCXO :
- Low phase noise
- Very high stability Vs environment
- Rad. Tolerant
- XO :
- Precision
- Jitter
- Good stability Vs environment
- Rad. Tolerant
- Crystal resonators:
- Aging +-0.5ppm
- Frequency stability
- Mounting automation
- Introduction of COTS solutions for specific applications ?
Increase of performances (phase noise, jitter, ageing precision), higher density & more integrated solutions, cost & LT reduction needed towards:
2021 – 2023
Continuous improvement regarding:
- Performances
- Harsh environment
- Radiation
- Size reduction
- Cost reduction
- Mounting automation
Connectors
2019 -2020
- High densitysolutions
- Reliable interconnection solutions
- High performances
- Connectors with SMD terminations
- Interposer solutions with solder-less terminations (spring probe) for board to board applications
- High data rate connectors
Modular/Flexible Power -Signal connectors, Fast locking & plugging solutions (Cost reductions), Solder-less solutions, connectors easy to mount and to repair at unit level needs towards:
2021 -2023
- Interposer solutions (RF application up to 20GHz)
- Connectors with Press fit terminations
- Connectors board to unit/device to board with solder-less terminations (spring probe)
- Optical solutions for very high speed flow of data
- Introduction of COTS solutions for specific applications
RF Passive Components
2019 -2020
- Components designed to be Glitch free
- Components designed to achieve a Shielding effectiveness of 75dBi
- 2.4 connectors (up to 50GHz)
- High power TNC connectors (300W/C band)
- SMP-Lock connectors (DC–22GHz)
- RF Passive components with SMP-L connectors (DC–22GHz)
- High power coaxial ISO(360W/L&S band)
- Power dividers with integrated ISO(X & Ku band)
Increase of Frequency at Payload and Equipment level, Fast locking & Integrated solutions needs towards:
2021 -2023
- Surface mount ISO/CIRC (X & Ku band)
- Increase of Power at Payload and Equipment level
- 1.85 connectors (up to 65GHz)
- High power connectors (L,S & C band)
- SMP-Lock connectors (DC–32GHz)
- RF Passive components with SMP-L connectors (DC–32GHz)
- High power coaxial ISO (L,S & C band)
- Power dividers with integrated ISO (Ka band)
- Surface mount ISO/CIRC (Ka band)
- Surface mount Switches
see the presentation linkhere:
