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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

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    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

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Vishay vPolyTan™ Solid Tantalum Chip Capacitors Increase Volumetric Efficiency to Save Space in Handheld Consumer Electronics

28.2.2016
Reading Time: 2 mins read
A A

source: Vishay news

MALVERN, Pa. — Feb. 23, 2016 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of vPolyTan™ solid tantalum surface-mount chip capacitors that delivers increased volumetric efficiency for handheld consumer electronics. Combining polymer tantalum technology with Vishay’s high-efficiency MicroTan® packaging, the T58 series achieves industry-best capacitance-voltage ratings in six molded case codes, including 47µF-6.3V in the compact M0 (1608-10) case and 220µF-10V and 330µF-6.3V in the BB (3528-20).

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Leveraging patented MAP (multi-array packaging) assembly technology, the capacitors released today provide a 10 % improvement in space utilization compared to similar devices, saving PCB space and enabling the design of smaller and thinner end products, including smartphones, tablets, and ultra-thin laptops, in addition to wireless cards, network equipment, and audio amplifiers and pre-amplifiers. In these devices, T58 series capacitors are intended for decoupling, smoothing, filtering, and energy storage applications.

The devices offer capacitance from 10 µF to 330 µF, with capacitance tolerance of ± 20 %, over voltage ratings from 4 V to 25 V in the MM (1608-09), M0 (1608-10), W9 (2012-09), A0 (3216-18), AA (3216-18), B0 (3528-10), and BB (3528-20) case codes. The capacitors feature low impedance, low ESR from 50 mΩ to 500 mΩ at 25 °C and 100 kHz, and ripple current from 0.224 A to 1.30 A at 100 kHz, and operate over a temperature range of -55 °C to +105 °C with voltage derating above +85 °C.

The rectangular molded case encapsulation of the T58 series is ideal for high-volume PCB assembly, and its special lead (Pb)-free L-shaped facedown terminations offer better contact to the solder pad than traditional facedown style terminations. RoHS-compliant, halogen-free, and Vishay Green, the devices feature a Moisture Sensitivity Level (MSL) of 3 and are available in tape and reel packaging per the EIA-481 standard.

Samples and production quantities of the T58 series capacitors are available now, with lead times of six to eight weeks for large orders.

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