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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Trending Tags

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Wk 32 Electronics Supply Chain Digest

24.8.2026
Reading Time: 3 mins read
A A


Electronics Supply Chain Weekly Digest 8-21-26.

DATAPOINT OF THE WEEK: S&P reported flash August Eurozone mfg PMI increased to 52.8 from 51.9 in July, remaining in expansion for the seventh consecutive month, supported by growth in new orders, production and the first expansion in new export business in 4.5 years.

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Wk 33 Electronics Supply Chain Digest

Germany’s flash mfg PMI significantly rose again to 54.1 from 52.2 in July, with new orders, production, and export sales all rising at their quickest rates since early-2022. S&P reported flash US mfg PMI decreased again to 53.2 from 53.8 in July, marking 13 months of being in expansion territory but a 5 month low as output and new orders grew at their weakest rate since March, appearing to reflect a slowdown in stock-building.

Headlines:

Auto/Transportation

  • Hyundai opens sales for its first China-built Ioniq EV which leans on Qualcomm cockpit silicon
  • US new-vehicle affordability holds flat in July at 35.4 weeks of median income as prices tick up and incentives compress 2.4% Y/Y, according to Cox
  • US new EV sales rebound 3.2% M/M in July as Tesla holds 55% share and incentives compress to 11.8% of transaction price, according to Cox

Datacenter

  • Nvidia commits up to $105B lease guarantee and $1.5B equity stake to anchor OpenAI’s 8GW Ohio datacenter

Connectivity

  • Molex announces strategic investment in active liquid cooling startup CAEPlus with exclusive licensing rights for pluggable I/O
  • SK Hynix announces CPO roadmap with global researchers, extending beyond HBM to tackle AI datacenter bandwidth wall

Industrial

  • China’s humanoid robot market pushes from demos into automotive, 3C, and logistics deployments as vendors chase repeat orders, says TrendForce

Semiconductors

  • Analog Devices reports a strong F3Q with $4B in revenue and guides 4Q revenue above expectations as AI datacenter and industrial chip demand accelerates
  • Micron commits $10B to new Boise memory research lab targeting HBM and AI compute systems
  • Nvidia denies plan to ship China-specific LPU by year-end, says no such product exists on its roadmap, according to The Information
  • SMIC and Hua Hong run near capacity ceilings as AI-driven mature-node demand books SMIC’s BCD power lines through 2027, according to South China Morning Post
  • STMicroelectronics readies third 2026 price hike as power device lead times stretch to 52 weeks, EE Times China reported
  • Waymo unveils in-house 5nm ASIC for robotaxis, diversifying away from Nvidia and AMD

Related

Source: Edgewater Research

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