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    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

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    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
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Wk 45 Electronics Supply Chain Digest

9.11.2026
Reading Time: 5 mins read
A A


Electronics Supply Chain Weekly Digest 11-6-26.

DATAPOINT OF THE WEEK: S&P reported Oct Eurozone mfg PMI decreased to 52.7 from 52.9 in Sept, remaining in expansion for the ninth consecutive month, with declines in France and Italy hindering further expansion. S&P noted that increased defense spending and precautionary inventory building are supporting expansion. Germany’s mfg PMI increased to 54.2 from 53.9 in Sept, remaining in expansion as new orders and production continue to grow, albeit at slower rates, with new export orders noted as accelerating. S&P reported US mfg PMI declined in Oct to 54.9 from 55.9 in Sept, marking the fifteenth straight month of expansion, though new orders and production grew at slower paces M/M, with S&P noting strong demand for AI-related goods straining supply chains. ISM US mfg PMI increased to 55.5 from 54.5 in Sept. RatingDog China mfg PMI decreased slightly to 52.0 from 52.1 in Sept, marking the eleventh straight month of expansion, with output growing at the fastest pace since April on solid new orders driven by new product launches and improved production capabilities, though selling prices fell amid intense competition. China’s government mfg PMI returned to contraction territory at 49.3 from 50.1 in Sept.

RelatedPosts

Wk 44 Electronics Supply Chain Digest

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

Wk 43 Electronics Supply Chain Digest

Headlines:

Auto/Transportation

  • Audi considers $3B second phase at Georgia assembly plant, adding to initial $4B buildout
  • BMW announces second cut to 2026 margin guidance as restructuring charges and China weakness weigh
  • Stellantis announces extension of Fiat 500 production stoppage at Mirafiori to a fourth straight week on chip shortage
  • Tesla’s China-made EV sales growth accelerates in October, extending streak to 12 straight months, Reuters reported
  • Toyota raises annual operating profit forecast 15% on hybrid demand and weaker yen, offsetting China slide
  • Toyota and Waymo announce plans for 2027 robotaxi launch in Japan using bZ4X EVs with Level 4 autonomy

Datacenter

  • Governments from New York to the Netherlands tighten datacenter restrictions on power, water, and permitting, per Reuters
  • Google announces $17B Wyoming datacenter as political resistance to AI infrastructure buildout mounts after US midterms, according to Reuters
  • Meta announces $15B five-part bond sale to help fund accelerating AI infrastructure investments
  • Microsoft has reportedly tightened oversight of neocloud datacenter projects from Nebius, IREN, and Nscale, as reported by Bloomberg
  • Oracle reportedly cancels $7B Tencent AI chip leasing deal under Trump administration pressure, as reported by Financial Times

Connectivity

  • AI networking value shifts toward scale-up interconnects and 1.6T optics as market heads to $279.8B by 2027, according to TrendForce
  • Marvell announces acquisition of Lumentum, creating a combined electro-optical player that could challenge Broadcom’s AI interconnect lead, according to TrendForce
  • Palomino Laboratories announces first commercial order for GaN Micro LED optical interconnect chips from hyperscale cloud customer
  • Panasonic Taiwan plant fire reportedly puts 4% of global high-end CCL supply at risk, per TrendForce

Industrial

  • Airbus announces January-October deliveries up 6.2% Y/Y to 621 jets, leaving 249 to hit its 870 full-year target

Semiconductors

  • AMD beats and raises on Datacenter strength, guides CY27 revenue up 80%+ as CPU outlook doubles
  • Apple warns of unprecedented memory chip costs squeezing margins as AI datacenter demand absorbs supply
  • Arm guides F3Q26 revenue slightly ahead of expectations and targets $2B in AGI CPU sales across FY27 and FY28, Reuters reported
  • Bosch announces plans to spin off semiconductor division in January 2028 to run as foundry alongside in-house supply
  • Diodes posts 3Q profit of $43.7M on $532.6M revenue as Gross Margin recovery gains momentum
  • Europe pledges about $589.6M for chip startups in push to narrow design and manufacturing gap with US and China
  • Global chip sales mark third straight quarter of 20%+ sequential growth in 3Q26, led by Americas, according to the SIA
  • Micron reportedly pauses $4.5B Taiwan memory fab over labor dispute, per Bloomberg News
  • Roughly 600K Nvidia H200 AI chips are reportedly stockpiled in Hong Kong as Beijing withholds large-volume import approvals, Reuters reported
  • Qualcomm handset chip revenue falls 26% as memory costs and Apple roll-off pressure core business
  • Alphabet discloses $548M Qualcomm stake as chipmaker pushes deeper into AI datacenter silicon, as reported by Reuters
  • Qualcomm announces its biggest 5G deal yet to supply Starlink Mobile’s planned nationwide US terrestrial network, according to Reuters
  • Skyworks announces F1Q26 revenue guidance below expectations on premium Android weakness as Qorvo acquisition closes
  • TSMC reportedly weighs push into 3D DRAM at Nvidia’s request, potentially setting up competition with Samsung, as reported by Reuters
  • Vishay posts 24% Y/Y revenue growth in 3Q26 on distribution push and industrial/AI passives demand

Related

Source: Edgewater Research

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