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    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

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    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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Wk 42 Electronics Supply Chain Digest

19.10.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 10-16-26.

DATAPOINT OF THE WEEK: Passenger car retail sales in China totaled 1.62M units in September, down 27.8% Y/Y, but up 5% M/M, according to the China Passenger Car Association (CPCA), marking the twelfth consecutive month of Y/Y declines. Despite the broader weakness, NEV penetration reached its highest recorded level ever at 67% of retail sales, up 9.2 percentage points Y/Y. NEV retail sales totaled 1.08M units, up 7.9% M/M, but down 16.4% Y/Y. Within that, BEV sales reached 770K units, up 9.6% M/M but down 7.4% Y/Y, while PHEV sales declined 31.8% Y/Y. Exports remained robust at 917K units, up 78% Y/Y, with NEVs comprising 60.8% of the total, growing 164% Y/Y.

RelatedPosts

Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

Headlines:

Auto/Transportation

  • BMW announces 3Q deliveries declined 6.3% Y/Y to 551k units as China volumes slump
  • China-EU deal to curb Chinese hybrid exports threatens $7.5B trade that tripled in 1H26 after EV tariffs, according to Reuters
  • Chinese automakers crowd Paris show as home-market slump turns European sales into a survival test, says Reuters
  • Global EV sales end six-month growth streak in September as NA and China declines offset record European demand, according to Benchmark Mineral Intelligence
  • Stellantis announces Citroen 2CV concept and affordable EV lineup at Paris Motor Show
  • Stellantis 3Q shipments slip 1% Y/Y as NA production halt knocks 12% off regional volume
  • Stellantis sees eventual US EV shift at slower pace than other regions as industry turns more regional
  • Toyota announces hybrid-only Lexus NX production in Ontario, Canada as US rivals downsize
  • US new-vehicle average transaction price nears record high in September on fourth straight monthly gain, according to Kelley Blue Book
  • US EV sales rebound in 3Q to highest volume in a year as share climbs to 6.4% of new-vehicle sales, as reported by Kelley Blue Book
  • US new-vehicle inventory rebounds in September as sales pace eases, Stellantis brands run heaviest, Cox Automotive reported
  • VW reports sharpest delivery drop in over four years as China volumes fall 38.5% Y/Y

Connectivity

  • CPO testing bottleneck shifts from alignment accuracy to speed as platform integration becomes the competitive battleground, as reported by TrendForce

Industrial

  • Schneider Electric announces higher 2026 targets for the second time this year on datacenter demand

Semiconductors

  • SEMI forecasts 300mm fab equipment spending to reach $227B by 2029 as AI drives capacity buildout
  • AMD raises 2030 CPU TAM forecast to over $200B, with 2026 called the year of inference
  • Arm targets $300B CPU market by 2030 as agentic AI reshapes datacenter demand
  • Japan announces plan to invest up to $21B in two GlobalFoundries New York fabs under US-Japan supply chain pact
  • Hyperscaler capex to surge 106% Y/Y to $957B in 2026 as AI server shipments climb 32% Y/Y, according to TrendForce
  • Infineon announces 200mm SiC wafer supply agreement with Wolfspeed to support shift from 150mm manufacturing
  • ByteDance reportedly nears MediaTek chip supply deal for its datacenter operations, Bloomberg News reported
  • Microsoft announces Maia 300 custom AI chip and plans multi-GW deployment next year
  • Nvidia loses ground in China AI chip market as Huawei closes gap under US export curbs, according to IDC
  • Volvo Cars announces expanded automated driving partnership with Nvidia to co-develop next-gen technology
  • SK Hynix reportedly conditions new US NAND fab on Washington approving expanded US chip equipment exports to its China site, according to Reuters

Consumer/Other

  • Global AR glasses shipments to more than double in 2026 as Meta Ray-Ban Display momentum pulls in rival brands, per TrendForce
  • Global smartphone shipments post worst 3Q since 2012 as memory shortage drives price hikes and production cuts, per Reuters

Related

Source: Edgewater Research

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