Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 37 Electronics Supply Chain Digest

29.9.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 9-25-26.

DATAPOINT OF THE WEEK: August new car registrations in Europe totaled 831K, below the 1M mark for the first time in five months on typical summer seasonality, increasing 5.2% Y/Y and down 26% M/M, according to ACEA data.

RelatedPosts

Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

BEVs maintained strong Y/Y growth, reaching 243K registrations, up 52.2% Y/Y and down 13.5% M/M, accounting for 29.2% of the market in August, up 9 percentage points Y/Y.

PHEVs also saw significant Y/Y growth, rising 13.8%. HEVs increased 3.4% Y/Y and declined 30% M/M. HEVs account for 32.8% of the market, down 0.6% Y/Y. ICE registrations declined 22% Y/Y and 32% M/M, marking its 28th straight month of Y/Y declines.

Headlines:

Auto/Transportation

  • BMW pushes back on EU tariffs against Chinese EV imports, urging voluntary pricing pacts to defuse escalation risk
  • China EV exports jump 33% Y/Y in August as Europe and Latin America pick up the slack for softening Asia demand, Bloomberg reported
  • Ford F-150 output halted for nearly a week at Michigan, US plant, hitting its highest-margin truck line, according to Reuters
  • Honda nearing decision on $2.5B Ohio hybrid plant as NA capacity tightens and USMCA talks cloud outlook, according to Nikkei
  • Tesla begins Semi electric truck deliveries at Nevada, US rollout event
  • VW’s MOIA America group launches first US robotaxi service in Orlando with Mobileye-equipped ID. Buzz vehicles operated by Beep
  • VW reallocates German production as EV plants fill up and combustion sites run below capacity

Datacenter

  • Google to launch first Project Suncatcher satellite next week, putting TPUs in orbit to test space-based AI datacenter concept

Connectivity

  • Peru targets 1M tons of added annual copper output as Chinese and US miners line up under new administration permitting reforms, as reported by Reuters
  • Semtech unveils 224G octal TIAs and MZM driver for CPO and NPO optical engines targeting AI back-end networks
  • Tower Semiconductor makes Japan its main optical chip hub with $4B buildout to feed Nvidia AI server demand, says Nikkei Asia

Industrial

  • Tesla launches Optimus Gen 3 manufacturing-readiness audits at Chinese suppliers Tuopu, Joyson, and Sanhua, per 21st Century Business Herald

Semiconductors

  • ABB launches Infinitus 800 VDC power portfolio for AI datacenters, extending Nvidia collaboration on gigawatt-scale architectures
  • Advanced packaging market set to hit $51B by 2031 as AI accelerators, HBM, and CPO drive 27% revenue CAGR, according to Yole
  • Chinese MLCC suppliers Viiyong and Chaozhou Three-Circle break into Dell, HP, ASUS, and Acer qualification as Murata pivots to AI, according to TrendForce
  • China SiC capacity tightens, pushing power device orders to Taiwanese foundries, according to DigiTimes
  • China audits Broadcom’s grip on state datacenter switching, weighing informal guidance to shift toward domestic suppliers, according to Financial Times
  • onsemi widens October price hikes across power portfolio as AI rack power demand tightens mature-node capacity
  • Valens Semiconductor and onsemi partner on cost-optimized MIPI A-PHY sensor for 3MP automotive cameras
  • Global server market hits record $166B in 2Q26 as memory-driven ASP inflation and component allocation reshape buyer behavior, according to the IDC
  • TSMC confirms 3-6% wafer price hike in January 2027 with order book booked through 2030
  • 12-inch wafer LTA prices set to jump 15-40%+ in 2027 as AI demand tightens supply, as reported by TrendForce

Related

Source: Edgewater Research

Recent Posts

Wk 39 Electronics Supply Chain Digest

10.10.2026
31

Wk 38 Electronics Supply Chain Digest

5.10.2026
37

Wk 36 Electronics Supply Chain Digest

29.9.2026
43

Wk 35 Electronics Supply Chain Digest

14.9.2026
59

Wk 34 Electronics Supply Chain Digest

7.9.2026
32

Wk 33 Electronics Supply Chain Digest

31.8.2026
60

Wk 32 Electronics Supply Chain Digest

24.8.2026
68

Wk 31 Electronics Supply Chain Digest

17.8.2026
76

Wk 30 Electronics Supply Chain Digest

3.8.2026
70

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved