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    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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Wk 35 Electronics Supply Chain Digest

14.9.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 9-11-26.

DATAPOINT OF THE WEEK: Passenger car retail sales in China totaled 1.54M units in August, down 22.8% Y/Y, but up 5.5% M/M, according to the China Passenger Car Association (CPCA), marking the eleventh consecutive month of Y/Y declines.

RelatedPosts

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Despite the broader weakness, NEV penetration reached its highest recorded level ever at 65.2% of retail sales, up 10 percentage points Y/Y. NEV retail sales totaled 1.01M units, up 5.7% M/M, but down 8.7% Y/Y.

Within that, BEV sales reached 700K units, up 1.7% Y/Y and 7.9% M/M, while PHEV sales declined 25.8% Y/Y. Notably, exports remained robust at 888K units, up 78% Y/Y, with NEVs comprising 58.3% of the total, growing 154% Y/Y.

Headlines:

Auto/Transportation

  • BYD lifts 2026 overseas sales target to 1.9M-2M vehicles and sets 2.5M goal for 2027 as export ramp offsets domestic slide
  • US Transportation Secretary urges Ford to sever ties with CATL and Geely as Republicans pile on over China dependencies, according to Reuters
  • Tesla announces Cybercab robotaxi rides in Austin, drawing US safety regulator scrutiny of program
  • US new-vehicle average transaction price tops $50K in August for first time in 2026 on richer SUV mix, according to Cox Automotive
  • VW earmarks $18.6B for biggest-ever restructuring, phasing out four German plants and cutting up to 60K jobs
  • Xiaomi signs MoUs with eight German Auto dealer groups, setting up 2027 European market entry

Datacenter

  • SpaceX shifts AI datacenter build strategy to prioritize backup and cooling, likely slowing down deployment timelines, according to The Information

Connectivity

  • Amphenol extends H4 solar connector line to 2000V DC as utility-scale PV moves beyond 1500V architectures
  • Foxconn Interconnect Technology licenses Amphenol’s high-speed backplane connector patents
  • Verizon announced a partnership with Corning for 80M miles of high-density optical fiber through 2032 in multi-$B supply deal

Industrial

  • Xpeng commissions automated Iron humanoid robot production line in China, targeting year-end mass production and 2027 deliveries

Semiconductors

  • Analog Devices announces $1.35B acquisition of Alif Semiconductor for edge AI microcontroller capabilities
  • Chinese AI chipmakers reportedly hike processor prices 20%-50% as HBM shortage squeezes domestic alternatives, as reported by Reuters
  • Global semiconductor sales jump 135% Y/Y to $146.8B in July as YTD total already tops any full year on record, according to the SIA
  • GlobalFoundries lands up to $375M CHIPS R&D award to scale domestic quantum semiconductor manufacturing
  • GlobalFoundries lands Monolithic Power Systems as long-term customer for 300mm Singapore fab, with volume production in early 2027
  • Murata to discontinue select consumer and automotive MLCC lines by 2029 as it redirects capacity to AI server demand
  • Nvidia to more than double Australia’s datacenter capacity with 2GW AI buildout by 2027 via four local partners
  • OpenAI pitches its models as a cheaper alternative to open-source tools for chip design work
  • OpenAI deepens Samsung chip collaboration, citing joint next-gen chip research as most advanced area of partnership
  • Qualcomm announces AWS partnership for potentially up to $60B in AI datacenter chip purchases
  • Samsung and ASML announce expansion of strategic partnership, targeting High NA EUV DRAM manufacturing by 2028
  • Semiconductor equipment billings hit record $40.5B in 2Q26 as AI capacity buildout drives second straight quarterly high, per SEMI
  • SolarEdge taps Infineon CoolSiC JFETs for solid-state circuit breakers in 800 VDC AI datacenter power distribution
  • STMicroelectronics guides optics to roughly 80% of 2027 AI revenue, signaling silicon photonics as the primary AI growth vector
  • TSMC posts record August revenue as AI chip demand keeps advanced nodes fully booked
  • TSMC’s 3nm set to overtake 5nm as top revenue node in 2H26 on Nvidia Rubin ramp and AI follow-on orders, according to TrendForce

Consumer/Other

  • Apple enters foldables with iPhone Duo, projected to capture 24.8% share behind Samsung in its first year, per TrendForce
  • Global smartphone production falls 8% Y/Y in 2Q26 as memory-cost pull-forward temporarily lifts 2026 outlook, according to TrendForce
  • US prosecutors open racketeering trial against Huawei, alleging 20-year scheme to steal trade secrets from Cisco, T-Mobile, and three other US firms, according to Reuters

Related

Source: Edgewater Research

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