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    Modeling and Simulation of Leakage Inductance

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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

    Fischer Releases High Vibration Robust Ratchet Locking USB-C Connector System

    Littelfuse Unveils High-Use Tactile Switches with 2 Million Cycle Lifespan

    KYOCERA AVX Releases Compact High-Directivity Couplers

    Supercapacitors Emerge as a Promising Solution to AI-Induced Power Energy Spikes

    Wk 18 Electronics Supply Chain Digest

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    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

    EMC Challenges for High Speed Signal Immunity and Low EMI

    MOSFET Gate Drive Resistors Power Losses

    Modified Magnetic Reluctance Equivalent Circuit and its Implications

    Improving Common Mode Noise Reduction while Decreasing BOM

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Würth Elektronik Webinar: Thermal simulation for MagI³C Power Modules using REDEXPERT

6.10.2020
Reading Time: 1 min read
A A

This webinar gives an introduction into the online design tool REDEXPERT® for MagI³C Modules. Focus of the webinar is on the self-developed thermal tool for REDEXPERT®.

With this tool, the power dissipation and surface temperature of the MagI³C Power Module can be determined and heat distribution on the entire PCB can be uniquely displayed on a heat map. Finally, an example of a thermally optimized module selection with REDEXPERT® is given using a concrete application, to show the added value of thermal simulation during the design-in phase.

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