Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Yageo Venture to Acquire 30% of APEC and Step Into Semiconductor MOSFET Business

23.5.2022
Reading Time: 3 mins read
A A

Yageo venture to acquire 30% Advanced Power Electronics (APEC) as one of the Taiwan’s biggest makers of metal-oxide semiconductor field-effect transistors (MOSFET). The Yageo alliance with APEC target to capture opportunities in analogue and power semiconductors through its global sales channels.

Hon Hai Precision Industry Co (鴻海精密) and Yageo Corp (國巨) yesterday said that they plan to acquire a 30 percent stake in local semiconductor manufacturer Advanced Power Electronics Corp (APEC, 富鼎) for about NT$2.89 billion (US$97.45 million) through a joint venture XSemi Corp, their latest effort to broaden their semiconductor portfolios.

RelatedPosts

YAGEO Offers High-Performance Diplexers for Dual-Band Wi-Fi 6E/7Integration

YAGEO Unveils Next Gen BMS Isolation Transformers

YAGEO Releases First to Market 750V Aluminum Capacitors

The joint venture, XSemi Corp (國創半導體), has offered to buy 35 million Advanced Power Electronics shares at NT$82.58 per share, statements filed by the companies to the Taiwan Stock Exchange showed.

Advanced Power Electronics is one of the Taiwan’s biggest makers of metal-oxide semiconductor field-effect transistors (MOSFET), a device that is widely used for switching and to amplify electronic signals. The company has developed a comprehensive product lineup with more than 1,000 MOSFET products on offer, it said.

Hsinchu-based XSemi is a chip designer that specializes in analogue and power semiconductors primarily used in automotive and industrial devices. The goal of the joint venture is to serve the strategic system customers and distributors around the world for both Hon Hai and YAGEO. Hon Hai has more than 40% market share in EMS in the world, and most of the large system companies are Hon Hai’s customers. YAGEO is the only top global passive component solution provider with a leading position in all of resistors, capacitors, and inductors, and its premium distribution channel has the most extensive reach with very high market penetration.

The collaboration would help XSemi expedite its business development process, and improve its product portfolio and customer reach, especially with more business opportunities emerging, such as electric vehicles, digital healthcare and robotics, the statement said.

“APEC’s products will also complement highly with XSemi’s internally developed power management ICs, silicon carbide chips and modules as total solutions to provide to Hon Hai and Yageo’s existing and future customers,” the statement said.

Hon Hai is a major iPhone assembler, while Yageo is the world’s No. 3 supplier of passive components.

“Semiconductors have been one of the three key technology pillars of Hon Hai,” said Hon Hai chairman Young Liu (劉揚偉), who is also chairman of XSemi.

“On top of XSemi’s participation through its analogue and power products on the auto collaborations, its power module has also shown great progress,” Liu said in the statement. “With the private placement of APEC, XSemi will be able to fill the gap in its low to high-voltage silicon MOSFET product line, and this will provide steady semiconductor supply for the two groups’ future strategic focus in industrial and automotive.”

Hon Hai said it has injected an additional NT$1.599 billion in XSemi by subscribing to new shares issued by the semiconductor company, boosting Hon Hai’s stake to 51 percent.

Yageo would hold a 49 percent stake of the joint venture with new investments of NT$1.5 billion through its subsidiaries.

“Our alliance with APEC is to capture the upcoming opportunities in analogue and power semiconductors,” Yageo chairman Pierre Chen (陳泰銘) said in the statement. “Once the products are ready, we believe that we can quickly deliver them to the customers through Yageo’s extensive global channels.”

Related

Source: Yageo

Recent Posts

Connector Industry Achieves Double-Digit Growth

19.8.2025
22

July 2025 ECST Components Survey Continue with Strong Sales Sentiment

4.8.2025
80

PCNS 2025 Final Program Announced!

4.8.2025
107

DigiKey Expands Inventory with Over 32,000 Stocking NPIs in Q2 2025

31.7.2025
16

European Components Distribution (DMASS) Faces Continued Decline in Q2 2025

30.7.2025
86

The Connector Industry is Undergoing Transformation

25.7.2025
91

Würth Elektronik Opens Branch in South Africa

24.7.2025
31

July 2025 Interconnect, Passives and Electromechanical Components Market Insights

23.7.2025
144

Samsung Electro-Mechanics Focuses MLCCs on AI servers and Automotive

22.7.2025
100

June 2025 ECST Components Survey Delivers Stunning Results

21.7.2025
42

Upcoming Events

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version