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    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
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3rd PCNS Final Program Released !

6.8.2021
Reading Time: 3 mins read
A A

3rd PCNS Passive Components Networking Symposium that will take place on 7-10th September, hosted by Politecnico di Milano, Italy is pleased to announce release of its final program. The third PCNS is organized as a hybrid event and it is possible to register either as a live or virtual attendee. Fee is equal allowing flexibility to change attendance type on last moment according to the pandemic situation and travel restrictions.

3rd PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS) ! The papers’ scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research.

RelatedPosts

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

SCHURTER THT DIP Switches Support Hardware-Level Configuration

The technical program looks impressive !

Check it out

Check it out on PCNS website online here (you can also see there program with on click paper abstracts) – OR – download the final program in pdf below:

The program is reach on technical papers, keynotes and invited papers from leading passive manufacturers and industry experts.

Live attendees, in addition can enjoy Italian cuisine supporting casual networking atmosphere during a Welcome Drink and Gala Dinner social events. An exclusive Alfa Romeo Museum tour prior the Gala Dinner may serve a good surroundings incentive to discuss hot topics around future passive components needs for automotive industry.

We hope in best – to meet finally face to face in September

Register and join us at the 3rd PCNS !

Online Registration Form

————————————-

PCNS Passive Components Networking Symposium is a bi-annual international symposium organized by EPCI European Passive Components Institute in co-operation with an European university. 3rd edition of the PCNS Passive Components Networking Days Symposium is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information and Bioengineering Faculty of Politecnico di Milano.

3rd PCNS is intended as a hybrid, live event with speakers present and streaming options for virtual attendees.

More information is available on the PCNS website:

www.PCNS.events

Related

Source: EPCI

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