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    Exxelia Releases Updated Microwave Materials and Frequency Tuning Catalogues

    Coilcraft Unveils Molded Power Inductors for High‑Current VRMs

    Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines

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    Exxelia Releases Updated Microwave Materials and Frequency Tuning Catalogues

    Coilcraft Unveils Molded Power Inductors for High‑Current VRMs

    Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines

    TDK Releases Ultra‑small EMI Noise Suppression Filters

    Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches

    SCHURTER Releases Compact SMT DIP Switches

    TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

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    Bourns Releases Compact High Current Shielded Power Inductors

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Advances in Film Capacitor Technology Enables Downsizing; Kemet Webinar

16.2.2021
Reading Time: 1 min read
A A

The constant trend of miniaturization, primarily driven by Moore’s Law, has affected all areas of electronics. Making things smaller doesn’t just make them easier to carry around, it enables a higher density of capabilities and features, as well as higher power densities and efficiencies. Generally, the first things to shrink are the integrated circuits, followed by other components.

For many years, MLCCs led the charge in down-sizing, but film capacitors didn’t follow. In this webinar, KEMET’s Hristina Kostadinova Boshkova (R&D Manager) talks about the advances in film technology that enables downsizing without sacrificing application performance.

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Source: Kemet Electronics

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