Murata has expanded its simulation support for engineers using Ansys tools by making downloadable component models available directly through its website.
The new Murata collaboration with Synopsys is aimed at shortening the loop between circuit design, electromagnetic analysis, and thermal validation. The collaboration covers Synopsys’ Ansys HFSS and Ansys Icepak environments, with the goal of making it easier for users to access the latest Murata simulation models from the manufacturer’s own site. The company positions this as a workflow improvement for engineers who need to account for both EMI behavior and temperature rise earlier in design.
Murata also states that it is the first company to offer passive component simulation models through Ansys Icepak, based on its own research as of June 15, 2026.
Key features and benefits
- Direct access from Murata’s site. Engineers can navigate from the simulation environment to Murata-hosted model downloads, which should reduce friction when updating component data.
- Two analysis domains covered. Ansys HFSS is used for electromagnetic field analysis, while Ansys Icepak is used for thermal analysis.
- Model coverage matched to component type. HFSS covers Murata RF inductors and MLCCs; Icepak covers Murata power inductors.
- Built for early-stage design. The main value is not just convenience, but earlier detection of EMI and thermal issues before prototype spins.
- Compatible with Ansys 2026 R1. That is the release level named in the announcement.
Why this matters
For passive component users, simulation quality often determines whether a design is stable on the first or second build. A realistic inductor or capacitor model can help predict parasitics, coupling, heating, and layout sensitivity before hardware is assembled.
That is especially useful in compact power stages, RF front ends, and dense digital boards where component behavior changes with frequency, current, and local temperature. In practical terms, this kind of model support can reduce rework in PFC stages, DC/DC converters, wireless modules, and other space-constrained designs.
Supported component families
| Analysis tool | Component family | Typical design use |
|---|---|---|
| Ansys HFSS | RF inductors | RF matching, filtering, antenna-related circuits |
| Ansys HFSS | MLCCs | Decoupling, filtering, high-frequency bypassing |
| Ansys Icepak | Power inductors | Power conversion, thermal validation, current handling |
Murata does not publish detailed electrical or mechanical ratings in the press release itself, so exact part-level values should be checked in the relevant manufacturer datasheet or model download page. That is important because simulation behavior depends on the specific package, case size, and operating condition.
Technical background
Murata says the models are built from its vertically integrated process, spanning raw material development, manufacturing, and final product processing. In practice, that usually matters because passive components are sensitive to construction details that are not obvious from a simple schematic symbol.
The announcement also emphasizes that electromagnetic behavior and temperature distribution vary significantly with design conditions. For engineers, that is a reminder that a “good enough” generic model can miss the exact corner cases that matter most in high-density boards.
Typical applications
These models are likely to be most useful in design flows that combine RF performance and thermal constraints. Common examples include:
- High-speed communications hardware.
- Compact power supplies and converters.
- EMI-sensitive industrial electronics.
- Dense consumer devices where layout space is limited.
- Modules where heat flow through nearby copper and components affects reliability.
In purchasing and design-in terms, the benefit is less about one single component and more about reducing uncertainty around the full assembly. That can help when comparing candidate parts from different package sizes or when checking whether a lower-profile component still meets thermal and EMI targets.
Design-in notes for engineers
- Use the correct model family. RF inductors, MLCCs, and power inductors are not interchangeable in simulation; each is mapped to the analysis type Murata specifies.
- Validate against the exact part number. The announcement is model-family level, so final design work should still be tied to the selected catalog part.
- Check operating point sensitivity. Inductor loss and temperature rise can change meaningfully with current, airflow, copper area, and board stack-up.
- Treat simulation as a guide, not a substitute. Final verification still needs bench measurements, especially in high-frequency or high-power applications.
- Watch version compatibility. Murata names Ansys 2026 R1, so teams using earlier tool versions should confirm support before integrating the models.
Availability and downloads
Murata says the following data is available for download from its website:
- Electromagnetic field analysis data for Ansys HFSS – RF inductors.
- Electromagnetic field analysis data for Ansys HFSS – MLCCs.
- Thermal analysis data for Ansys Icepak – Power inductors.
For product data inquiries, Murata directs users to its contact forms for inductor and capacitor products. That suggests the company expects the new model access to complement, not replace, the normal datasheet and support flow.
Source
This article is based on Murata’s official press release announcing the Synopsys collaboration and the associated model downloads. Product-level electrical and mechanical details are not expanded in the release, so part-specific confirmation should be taken from the relevant Murata datasheet or model page.
