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    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

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    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

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Bourns Releases New AEC-Q200 Compliant Thick Film Chip Resistor Arrays

14.4.2021
Reading Time: 1 min read
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Riverside, California – April 6, 2021 – Bourns is pleased to announce the introduction of the new AEC-Q200 compliant Model CATxxA-LF, CAYxxA-LF and CAYxxA-AS Thick Film Chip Resistor Arrays. These new surface mount models help strengthen and further expand the range of surface mount chip arrays offered by Bourns.

The new AEC-Q200 compliant Model CATxxA-LF concave and CAYxxA-LF convex chip arrays are available in two different widths of 1 and 1.6 mm and contain two or four pieces of isolated thick film resistive elements printed onto a single ceramic substrate.

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The Model CAYxxA-AS are the first chip arrays from Bourns that are both AEC-Q200 compliant and sulfur-resistant based on ASTM-B-809-95, and EIA-977 (test parameter B) standards.They are designed to operate in certain harsh environments exposed to higher levels of sulfur contamination and are suitable for usage within industrial, automation power supply and communication base stations applications.

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Source: Bourns

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