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    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

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    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Trending Tags

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    • RF
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Bourns Releases New AEC-Q200 Compliant Thick Film Chip Resistor Arrays

14.4.2021
Reading Time: 1 min read
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Riverside, California – April 6, 2021 – Bourns is pleased to announce the introduction of the new AEC-Q200 compliant Model CATxxA-LF, CAYxxA-LF and CAYxxA-AS Thick Film Chip Resistor Arrays. These new surface mount models help strengthen and further expand the range of surface mount chip arrays offered by Bourns.

The new AEC-Q200 compliant Model CATxxA-LF concave and CAYxxA-LF convex chip arrays are available in two different widths of 1 and 1.6 mm and contain two or four pieces of isolated thick film resistive elements printed onto a single ceramic substrate.

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The Model CAYxxA-AS are the first chip arrays from Bourns that are both AEC-Q200 compliant and sulfur-resistant based on ASTM-B-809-95, and EIA-977 (test parameter B) standards.They are designed to operate in certain harsh environments exposed to higher levels of sulfur contamination and are suitable for usage within industrial, automation power supply and communication base stations applications.

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Source: Bourns

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