Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

    SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics

    TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

    Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

    Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

    SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics

    TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

    Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

    Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Passive Components in 2026: From Invisible Commodity to Design Parameter

15.6.2026
Reading Time: 10 mins read
A A

Passive components rarely make headlines, yet they quietly determine whether new designs can be built on time and at the target cost. In 2026, changing demand profiles, new applications, and evolving trade conditions are all visible in how capacitors, resistors, and magnetics are specified and sourced.

This article summarises key observations for passive components market trends in 2026 and outlines practical design and sourcing recommendations.

RelatedPosts

Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

Bourns Releases Automotive Gate Driver Transformer for Isolated Power

Wk 25 Electronics Supply Chain Digest

Key takeaways

The market developments and in the underlying supply‑chain analysis can be summarised into a few practical points for passive components:

  • Passive components are increasingly influenced by application mix and regional developments, with AI data centres, EVs and infrastructure adding new, relatively stable demand streams alongside traditional markets.
  • The current environment is best described as under segmented allocation tension: specific technologies and grades, such as high‑capacitance and automotive MLCCs, show extended lead times and price steps, while many commodity ranges remain well supplied.
  • Design decisions have a growing impact on supply flexibility. Using widely adopted values and case sizes, keeping layout options for alternative technologies and documenting second sources all support easier adjustments over a product’s lifetime.
  • On the sourcing side, simple practices—segmenting passives by criticality, monitoring lead times for strategic families, buffering selected items and watching upstream material and policy signals—provide most of the benefit without large process changes.
  • Compared to 2018, the path forward is less about preparing for a universal shortage and more about aligning design and procurement practices with a more differentiated, application‑driven passive market.

What is changing around passives

Several current trends are relevant for passive components:

  • New demand from AI and data centres
    AI accelerators, high‑speed networking and dense power conversion increase the use of high‑frequency MLCCs and high‑Q inductors in data‑centre hardware, adding a sizeable, relatively stable demand stream on top of automotive, consumer and industrial applications.
  • Steady growth in overall consumption
    Recent market studies still indicate mid‑single‑digit to low‑double‑digit MLCC revenue growth, with several forecasts placing 2026–2028 market size in the low‑ to mid‑teens billion USD range. Applications such as EVs, 5G and IoT continue to increase the passive component count per system.
  • More region‑specific patterns
    Tariffs, trade measures and regional industrial policies encourage shifts in manufacturing and sourcing geographies. This can create local demand spikes or stock‑building in particular regions or product families, even when global demand appears balanced.
  • Higher sensitivity to materials and capacity
    Price movements in silver, copper, palladium and other metals are more directly reflected in passive pricing, particularly for higher‑performance series. When factory utilisation is high, comparatively small changes in demand or policy can translate into longer lead times.

Overall, passives remain broadly available, but their behaviour is more strongly coupled to application mix and regional developments than a decade ago.

Practical consequences at component level

For engineering and procurement teams, these trends appear as a set of practical, day‑to‑day effects rather than abstract market movements. Lead‑time planning, for example, now benefits from more granularity. Lead times for some MLCC families at major manufacturers have been reported in the 26–32 week range, particularly for high‑end and automotive‑grade series. Resistors and inductors can also experience extended lead times when demand strengthens in selected segments or when distributors and OEMs in a given region decide to increase safety stocks.

Price development has also changed character. Rising input‑material prices and solid demand have led to stepwise price adjustments in several passive categories. Instead of short‑lived spikes followed by rapid normalisation, prices often stabilise at a new level, which is relevant for life‑cycle cost calculations and for setting expectations in long‑term agreements.

Design decisions themselves now have a more visible influence on sourcing flexibility. When a design relies heavily on unusual capacitance values, narrow voltage ratings or uncommon case sizes, it can be harder to identify suitable alternatives if demand for that exact combination increases. In contrast, designs based on widely used values, ratings and footprints typically benefit from a larger pool of compatible parts and more options for second sourcing and regional substitution. These consequences are manageable, provided they are considered early in the design flow and mirrored in sourcing strategy.

Design habits that support flexibility

Some design practices are particularly helpful under current conditions because they preserve options across manufacturers, regions and technologies rather than locking a design into a narrow component choice.

The choice of values and case sizes is one such lever. Preferring widely used capacitance values, voltage ratings and case sizes where performance allows increases the number of compatible parts available from different manufacturers. Second‑source thinking at design time is another useful habit. Qualifying at least two manufacturers or technologies for critical positions, such as key MLCC nodes on power rails, makes it significantly easier to rebalance sourcing if one vendor, technology or region becomes constrained. Layout choices also play a role: maintaining reasonable margin in footprint and creepage or clearance distances can allow a later change between, for example, MLCC and polymer technologies without a major PCB redesign. Finally, documenting acceptable alternates and the required requalification steps for “special” passives as part of the design package can shorten response time when substitutions are needed in production.

The table below summarises these design habits.

Design habits to update

Design habitPractical changeBenefit
Value and case selectionPrefer widely used capacitance values, voltage ratings and case sizes where performance permits.Larger pool of suitable parts and easier second sourcing.
Second‑source thinkingQualify at least two manufacturers or technologies for critical positions (for example key MLCC nodes on power rails).Simplifies rebalancing when one vendor or region is constrained.
Layout flexibilityKeep reasonable margin in footprint and creepage/clearance for potential alternative technologies (for example MLCC vs. polymer).Allows technology changes without major PCB redesign.
Documentation of optionsCapture acceptable alternates and requalification steps for “special” passives as part of the design package.Faster engineering response when substitutions are required in production.

These measures are incremental and can be phased in over time, but together they significantly improve the flexibility of a design across its lifetime.

Sourcing and planning practices that add robustness

On the supply‑chain side, a small number of targeted practices can improve predictability without requiring large organisational changes. A first step is to segment passive components by impact and interchangeability. Families such as high‑capacitance MLCCs, automotive‑grade series and key magnetics often combine high performance relevance with limited substitution options, so they benefit from closer monitoring and more frequent dialogue with suppliers.

Lead‑time monitoring is more informative when it focuses on these strategic families rather than only tracking aggregate averages for all passive components. Early signs of lead‑time extensions often appear in specific product lines, and noticing these trends enables earlier planning discussions. Building moderate buffers on a defined set of strategic passive types, instead of holding broad, undifferentiated safety stock, can further improve availability where it matters most while keeping inventory levels under control.

Finally, watching upstream signals such as movements in silver, copper or tantalum prices and following policy changes that influence manufacturing or trade provides additional warning time before effects reach finished components. Adjustments in sourcing patterns or, in some cases, design choices can then be planned rather than improvised.

The following table summarises these sourcing and planning practices.

Sourcing and planning practices

AreaPractical practiceEffect
Component segmentationIdentify which passive families (for example high‑capacitance MLCCs, automotive‑grade series, key magnetics) are performance‑critical and less interchangeable.Focus monitoring and supplier dialogue on the most impactful items.
Lead‑time monitoringTrack lead‑time trends for these families, not only aggregate averages for all passives.Earlier indication when specific lines begin to stretch.
Targeted bufferingBuild moderate buffers on strategic passive types rather than broad, undifferentiated safety stock.Better availability for critical items with controlled inventory levels.
Upstream signal trackingMonitor key materials (for example silver, copper, tantalum) and policy changes that influence component pricing and availability.Additional time to adjust sourcing or design before effects reach finished components.

These actions can be integrated into existing component engineering and procurement processes and scaled according to product volume and criticality.

“Allocation” today vs. 2018

An important observation is that current supply‑demand tension around passive components does not look like the broad “allocation” phase many readers remember from 2018. Back then, extended lead times and shortages affected a wide spectrum of MLCCs across voltage classes, case sizes and application segments more or less at the same time, with generalised allocation policies at major manufacturers.

In 2026 the situation is more segmented. Lead‑time extensions and pricing steps are concentrated in specific families, technologies and grades rather than across the entire catalogue. High‑capacitance MLCCs, selected automotive‑grade series and certain magnetics see the strongest effects, particularly where they overlap with fast‑growing applications such as AI servers and EV power electronics. Other commodity ranges remain comparatively stable and are still widely available from multiple sources.

For design and sourcing teams, this means that detailed component segmentation and targeted monitoring are more effective than treating all passives as being “in allocation”. It also underlines the value of designing around widely available values and footprints and qualifying alternatives in the more exposed families.

June 2026 update – AI servers now visibly strain high‑end MLCC lead times.

Recent statements from Holy Stone Enterprise, cited by European distributors, indicate that high‑grade MLCC lead times have already pushed beyond roughly 20 weeks, with supply constraints likely to persist into 2027 as AI server power subsystems consume a rising share of premium capacitance. This reinforces the trend described above: instead of a universal shortage, we see growing stress concentrated in strategic MLCC categories tied to AI data centres, where allocation and redesign risk are now material design parameters rather than background noise.

For OEMs and Tier‑1s targeting AI and high‑performance compute, this means treating certain MLCC lines as strategic components that justify closer lead‑time monitoring, alternate footprints and limited buffering, even while other passive families remain broadly available.

Summary – Outlook for passive components

Looking ahead, passive components are expected to remain available across a wide range of technologies and suppliers. Their influence on schedule, cost and design flexibility, however, is increasing as content per system grows and new applications such as AI servers and electric vehicles expand demand.

For design engineers, treating passives as explicit design parameters—values, packages and technologies selected with flexibility in mind—supports robust designs and smoother second sourcing. For supply‑chain and procurement teams, applying familiar concepts such as segmentation, lead‑time monitoring and targeted buffering to a selected set of passive categories can enhance overall resilience without excessive inventory.

Sources

  • Geopolitics and regional trends:
    • Geopolitical Tensions Expose Fragility in High‑Tech Supply Chains – EE Times Asia
    • Tariffs and AI Uncertainty Scramble the Electronics Supply Chain – Supplyframe Intelligence
  • Market and demand outlook:
    • 2026 Global Electronic Components Market Outlook
    • MLCC Market Demand: Driving Technology Forward – Passive Components Blog
    • Multilayer Ceramic Capacitor Market Size & Share, 2033 – Persistence Market Research
  • Lead times, pricing and utilisation:
    • The Biggest Supply Chain Risk of 2025 Might Not Be Chips – Instagram post
    • February Update: Price Surge Sweeps Across Component Categories – LinkedIn
  • Application and AI‑related demand:
    • 2026 Supply Chain Alert: The AI Components in High Demand
    • Power Electronics Outlook 2026: Overcapacity, AI Load, and the Geopolitics of the Supply Chain

Related

Recent Posts

Bourns Releases Automotive Gate Driver Transformer for Isolated Power

22.6.2026
5

Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

19.6.2026
8

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

19.6.2026
16

Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

19.6.2026
21

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

18.6.2026
78

Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

17.6.2026
28

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

17.6.2026
26

Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN

17.6.2026
54

YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering

16.6.2026
31

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version