Aerospace & Defence

Exxelia has announced its participation in the IEEE Applied Power Electronics Conference and Exposition (APEC) 2026, taking place from March...

ESA SPCD organizing committee is delighted to announce that the Call for Papers for the 6th edition of the International...

Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...

Peak Nano and E&P Technologies have announced a partnership to co‑develop fusion‑grade, high‑energy‑density film capacitors based on Peak Nano’s NanoPlex...

ECIA’s latest Industry Pulse survey for February 2026 confirms that sales optimism continues to climb across every major sector of...

The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...

SCHURTER’s USE 2410 is a quick-acting, wire-in-air surface‑mount fuse in the compact 2410 footprint, designed for both AC and DC...

Vishay’s new RCA‑SR e3 series are AEC‑Q200 qualified thick film chip resistors designed for sulfur‑rich and thermally demanding environments in...

Dr. Vladimir Azbel, an independent consultant on tantalum capacitors, analyzes structural changes in tantalum anodes of chip capacitors during long-term...

TJ Green Associates LLC announces the Call for Presentations for the 29th Annual Components for Military & Space Electronics (CMSE)...