News

Electronics Supply Chain Weekly Digest 4-25-25 DATAPOINTS OF THE WEEK: New car registrations in Europe increased 0.3% Y/Y in March,...

The paper Layer-By-Layer Printed Dielectrics For Next-Generation Film Capacitors For Energy Efficient Space Systems was presented by William Greenbank, University...

This paper Stress Testing of Chip Aluminum Polymer Capacitors was authored by Alexander Teverovsky Jacobs Technology Inc., NASA/GSFC and presented by Jay...

This paper on 70GHz high frequency behavior of chip thin film resistors following AEC-Q200 qualification tests was presented by Benjamin...

This paper 3D printing of passive electronic components from the perspective of a components manufacturer was presented by Johann Pichler,...

This paper on new fast lock RF interface was presented by Olivier Berenfeld, Radiall SA, France during the 5th Space...

This paper on novel high energy graphene material for supercapacitors was presented by Tomas Zednicek, EPCI European Passive Components Institute during...

Hirose introduces FH81 series with one action and top & bottom contact connectors that improve design flexibility and workability in...

Stackpole Electronics announces the addition of a 0.2 milliohm value to its 3-watt rated CSNL2512 current sense resistor. This new...

This article published in Nature Communications Journal discusses advancements in high-frequency capacitors development by combining EDLC supercapacitors with electrolytic capacitors,...