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News
FBDi: German Component Distribution Significantly Declined in Q319
German component distribution shrinks by 12.6% in third quarter 2019 (according to FBDi e.V.). Orders are declining. Berlin, 25 November...
Read moreDetailsAVX Releases High-Temperature 150°C Glass-Encapsulated Multilayer Varistors
Designed for use in high-temperature, high-energy, & harsh-environment automotive, industrial, & oil & gas applications, the new TransGuard® Automotive VGAH...
Read moreDetailsBourns Announces High Efficiency Flyback Power Transformer in Isolated Mode
RIVERSIDE, Calif., Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced an addition to the company's flyback...
Read moreDetailsFailure Analysis of Capacitors and Inductors
"Failure analysis of capacitors and inductors" article by Javaid Qazi and Masahai Ikeda from KEMET Electronics appeared in ASM International®...
Read moreDetailsIntroducing Capacitor Solutions for Space Constrained Mains Powered Applications
With a trend to increased functionality in the same or smaller spaces, and industry and consumer demand for portable solutions,...
Read moreDetailsMurata Announces the World’s First 150 degrees Celsius Common Mode Choke Coil for Automotive Ethernet
Murata Manufacturing Co., Ltd. today announced the DLW32MH201YK2, a common mode choke coil (CMCC) for Automotive Ethernet*1 (100BASE-T1*2). Withstanding extreme...
Read moreDetailsTDK Releases its Application Guide on Motor/Inverter Circuit Configuration
As the electrification of the automotive progresses, the demand for motor generators is on the rise. There is also a...
Read moreDetailsEMS see potential tighter component supply in 2020
Some electronics purchasers think the movement to 5G networks and handsets and a lack of extra capacity could result in...
Read moreDetailsCeramic Safety SMD Capacitor Digital Datasheet
KEMET’s new CAS series SMD safety certified MLCCs are offered with case sizes of 1808, 1812, 2211 and 2220. Their...
Read moreDetailsWide Bandgap Materials: The Future of High Power Density, High Efficiency Circuits
Philip Lessner, CTO and Chief Scientist at KEMET Electronics published overview of upcoming wide bandgap materials and how his company...
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