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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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Graphene “nano-origami” Creates Tiniest Microchips Yet

23.2.2021
Reading Time: 2 mins read
A A
The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The tiniest microchips yet can be made from graphene and other 2D-materials, using a form of ‘nano-origami’, physicists at the University of Sussex have found.

This is the first time any researchers have done this, and it is covered in a paper published in the ACS Nano journal.

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How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

By creating kinks in the structure of graphene, researchers at the University of Sussex have made the nanomaterial behave like a transistor, and have shown that when a strip of graphene is crinkled in this way, it can behave like a microchip, which is around 100 times smaller than conventional microchips.

Prof Alan Dalton in the School of Mathematical and Physical Sciences at the University of Sussex, said:

“We’re mechanically creating kinks in a layer of graphene. It’s a bit like nano-origami.

“Using these nanomaterials will make our computer chips smaller and faster. It is absolutely critical that this happens as computer manufacturers are now at the limit of what they can do with traditional semiconducting technology. Ultimately, this will make our computers and phones thousands of times faster in the future.

“This kind of technology – “straintronics” using nanomaterials as opposed to electronics – allows space for more chips inside any device. Everything we want to do with computers – to speed them up – can be done by crinkling graphene like this.”

Dr Manoj Tripathi, Research Fellow in Nano-structured Materials at the University of Sussex and lead author on the paper, said:

“Instead of having to add foreign materials into a device, we’ve shown we can create structures from graphene and other 2D materials simply by adding deliberate kinks into the structure. By making this sort of corrugation we can create a smart electronic component, like a transistor, or a logic gate.”

The development is a greener, more sustainable technology. Because no additional materials need to be added, and because this process works at room temperature rather than high temperature, it uses less energy to create.

Related

Source: University of Sussex

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