Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Graphene “nano-origami” Creates Tiniest Microchips Yet

23.2.2021
Reading Time: 2 mins read
A A
The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The tiniest microchips yet can be made from graphene and other 2D-materials, using a form of ‘nano-origami’, physicists at the University of Sussex have found.

This is the first time any researchers have done this, and it is covered in a paper published in the ACS Nano journal.

RelatedPosts

TT Electronics: Resistor and Sensing Trends at electronica 2026

Toray Film Capacitor Enables 150°C Inverter Operation

Silicon Capacitors and Integrated Passives Dossier Report 10/26

By creating kinks in the structure of graphene, researchers at the University of Sussex have made the nanomaterial behave like a transistor, and have shown that when a strip of graphene is crinkled in this way, it can behave like a microchip, which is around 100 times smaller than conventional microchips.

Prof Alan Dalton in the School of Mathematical and Physical Sciences at the University of Sussex, said:

“We’re mechanically creating kinks in a layer of graphene. It’s a bit like nano-origami.

“Using these nanomaterials will make our computer chips smaller and faster. It is absolutely critical that this happens as computer manufacturers are now at the limit of what they can do with traditional semiconducting technology. Ultimately, this will make our computers and phones thousands of times faster in the future.

“This kind of technology – “straintronics” using nanomaterials as opposed to electronics – allows space for more chips inside any device. Everything we want to do with computers – to speed them up – can be done by crinkling graphene like this.”

Dr Manoj Tripathi, Research Fellow in Nano-structured Materials at the University of Sussex and lead author on the paper, said:

“Instead of having to add foreign materials into a device, we’ve shown we can create structures from graphene and other 2D materials simply by adding deliberate kinks into the structure. By making this sort of corrugation we can create a smart electronic component, like a transistor, or a logic gate.”

The development is a greener, more sustainable technology. Because no additional materials need to be added, and because this process works at room temperature rather than high temperature, it uses less energy to create.

Related

Source: University of Sussex

Recent Posts

tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
20
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
16
Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

Antiferroelectric Hafnia at the 2D Limit

29.9.2026
33

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
50
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
38

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
80

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
157

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
113

Molecular Memristor Shows Record 145 kH Emergent Inductance

12.5.2026
82

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved