Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

    TDK Releases High Temp 175C Automotive NTC thermistors

    TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Vishay Releases Sulfur‑Resistant Chip Resistors

    Würth Elektronik Introduces Lead-Free SMT Spacers

    Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

    TDK Releases High Temp 175C Automotive NTC thermistors

    TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Vishay Releases Sulfur‑Resistant Chip Resistors

    Würth Elektronik Introduces Lead-Free SMT Spacers

    Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Graphene “nano-origami” Creates Tiniest Microchips Yet

23.2.2021
Reading Time: 2 mins read
A A
The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The wrinkle kinks that cause changes in Raman signals of altered electronic property. (Credit: University of Sussex)

The tiniest microchips yet can be made from graphene and other 2D-materials, using a form of ‘nano-origami’, physicists at the University of Sussex have found.

This is the first time any researchers have done this, and it is covered in a paper published in the ACS Nano journal.

RelatedPosts

MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

By creating kinks in the structure of graphene, researchers at the University of Sussex have made the nanomaterial behave like a transistor, and have shown that when a strip of graphene is crinkled in this way, it can behave like a microchip, which is around 100 times smaller than conventional microchips.

Prof Alan Dalton in the School of Mathematical and Physical Sciences at the University of Sussex, said:

“We’re mechanically creating kinks in a layer of graphene. It’s a bit like nano-origami.

“Using these nanomaterials will make our computer chips smaller and faster. It is absolutely critical that this happens as computer manufacturers are now at the limit of what they can do with traditional semiconducting technology. Ultimately, this will make our computers and phones thousands of times faster in the future.

“This kind of technology – “straintronics” using nanomaterials as opposed to electronics – allows space for more chips inside any device. Everything we want to do with computers – to speed them up – can be done by crinkling graphene like this.”

Dr Manoj Tripathi, Research Fellow in Nano-structured Materials at the University of Sussex and lead author on the paper, said:

“Instead of having to add foreign materials into a device, we’ve shown we can create structures from graphene and other 2D materials simply by adding deliberate kinks into the structure. By making this sort of corrugation we can create a smart electronic component, like a transistor, or a logic gate.”

The development is a greener, more sustainable technology. Because no additional materials need to be added, and because this process works at room temperature rather than high temperature, it uses less energy to create.

Related

Source: University of Sussex

Recent Posts

TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

16.2.2026
9

Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

20.1.2026
51
Credit: Institute of Science Tokyo

Researchers Demonstrated 30nm Ferroelectric Capacitor for Compact Memory

2.1.2026
50

Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

19.12.2025
132

Researchers Present Novel Graphene-Based Material for Supercapacitors

3.12.2025
56

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
70

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
73

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
63
a Schematic diagram of the BNT-based components constructed based on the entropy-increase strategy. b Digital photograph, cross-sectional SEM image, and EDS mappings of the MLCCs. c Unipolar P-E loops of MLCCs as a function of applied E. d Wrec and η of the MLCCs as a function of applied E. The comparison of (e) Wrec and η, (f) η and UF of the MLCCs with those of other recently reported state-of-the-art MLCCs. source: Nature Communications

Researchers Proposed Enhanced Energy Storage MLCC

1.10.2025
58

Upcoming Events

Feb 24
16:00 - 17:00 CET

Mastering Galvanic Isolation: Ensuring Safety in Power Electronics

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • 3-Phase EMI Filter Design, Simulation, Calculation and Test

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version