Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
Reading Time: 4 mins read
A A

Ultra-thin magnets, only a few atoms thick, could enable smaller, more powerful devices, but currently only work at extremely cold temperatures. A team of international researchers led by the University of Ottawa have combined them with topological insulators to improve magnetic ordering and enable operation at higher temperatures.

Introduction

The study explores how coupling a two-dimensional (2D) ferromagnet—monolayer chromium telluride (Cr₂Te₃)—with a topological insulator (TI) can significantly enhance its magnetic properties. Using molecular beam epitaxy (MBE), researchers achieved wafer-scale growth of high-quality Cr₂Te₃ films down to a single monolayer on insulating substrates. They discovered that proximity to a TI, specifically (Bi,Sb)₂Te₃, increases the Curie temperature (T₍C₎) and magnetization, with experimental and theoretical evidence pointing to the Bloembergen–Rowland (BR) interaction as the underlying mechanism. This work opens pathways for designing interface-engineered magnetic topological devices.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

Key Points

  • Material & Growth: Wafer-scale monolayer Cr₂Te₃ grown on SrTiO₃ (111) and Al₂O₃ (001) substrates via MBE.
  • Ferromagnetism in 2D Limit: Robust ferromagnetism persists down to a single monolayer.
  • TI Coupling Effect: Proximity to (Bi,Sb)₂Te₃ raises T₍C₎ from ~100 K to ~120 K in 2 ML films.
  • Experimental Evidence: Polarized neutron reflectometry (PNR) confirms significant magnetization enhancement with TI coupling.
  • Theoretical Model: BR interaction from TI surface states mediates stronger exchange coupling and perpendicular magnetic anisotropy.
  • Broader Implications: Strategy applicable to other 2D magnets for spintronic and quantum devices.

Extended Summary

Background & Motivation
Magnetism in 2D materials has become a focal point for next-generation information technologies, enabling applications in sensors, memory, and quantum devices. While several van der Waals magnets have been studied, achieving wafer-scale monolayer magnets on insulating substrates remains challenging. Cr₂Te₃ stands out due to its favorable crystalline and magnetic properties, including perpendicular magnetic anisotropy and compatibility with TI materials.

Material Growth & Characterization
The team synthesized Cr₂Te₃ films using MBE under Te-rich conditions, ensuring high crystallinity and atomically sharp interfaces. Structural analysis via RHEED, XRD, HRSTEM, and Raman spectroscopy confirmed uniformity and phase purity. Electrical transport measurements revealed metallic behavior in thick films and insulating tendencies in ultrathin layers, with anomalous Hall effect (AHE) signatures confirming ferromagnetism down to a single monolayer.

Magnetism Enhancement via TI Coupling
When 2 ML Cr₂Te₃ was interfaced with a 4-quintuple-layer (Bi,Sb)₂Te₃, the Curie temperature increased from ~100 K to ~120 K. Hall measurements and Arrott plots confirmed this enhancement, while PNR provided depth-resolved magnetization profiles, showing more than a twofold increase in saturation magnetization upon TI coupling. This effect was consistent across different substrates and measurement conditions.

Theoretical Insights
A model Hamiltonian was developed to describe the interaction between TI surface states and localized Cr moments. The analysis identified the Bloembergen–Rowland interaction—arising from virtual interband transitions in the TI—as the dominant mechanism enhancing ferromagnetic order and perpendicular magnetic anisotropy. The model predicts that this mechanism is broadly applicable to other TI–magnet heterostructures, with experimental parallels in materials like Cr₂Ge₂Te₆, Fe₃GeTe₂, LaCoO₃, and SrRuO₃.

Implications for Device Design
The findings suggest that TI-mediated exchange coupling can be a universal strategy for boosting T₍C₎ in 2D magnets, enabling stable ferromagnetism at higher temperatures. This has direct implications for spintronic devices, quantum information processing, and the development of all–van der Waals heterostructures.

Conclusion

This work demonstrates that monolayer Cr₂Te₃ retains robust ferromagnetism and that its magnetic properties can be significantly enhanced through proximity to a topological insulator. The combination of experimental measurements and theoretical modeling confirms the role of the Bloembergen–Rowland interaction in this enhancement. Beyond Cr₂Te₃, the approach offers a generalizable pathway for engineering high-performance 2D magnetic systems, paving the way for advanced magnetic topological electronics and spintronic applications.

Read the full paper:

Enhanced ferromagnetism in monolayer Cr2Te3 via topological insulator coupling

Published by IOP Publishing Ltd
Reports on Progress in Physics, Volume 88, Number 6

Citation Yunbo Ou et al 2025 Rep. Prog. Phys. 88 060501DOI 10.1088/1361-6633/add9c5

Related

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
11

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
15

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
35

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
20

Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

27.8.2026
27

Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

26.8.2026
34

Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

24.8.2026
43

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
125

Single Pair Ethernet for Humanoid Robot In-Robot Networks

17.8.2026
179

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved