Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Hirose Offers New Stacking Height Variations to Board-to-FPC Connector

23.4.2025
Reading Time: 3 mins read
A A

Hirose releases new stacking height variations to its BK13 series, board-to-FPC connectors with enhanced space efficiency and functionality for consumer devices.

As smartphones and wearable devices become slimmer and more functional, Hirose has expanded the stacking height variations of the BK13 Series to improve board design flexibility while maintaining high power supply capacity.

RelatedPosts

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

Hirose Electric to Establish Automotive Connector Plant in India

Hirose Releases High Current Vibration-Resistant Connectors

The 5A current rating and robust design address the challenges of consumer devices that demand more features in a lighter, more compact form. 

Trend and Issues in the Design of Consumer Devices

Innovative products such as smart home appliances and AI-powered devices are emerging to make our daily lives more convenient. These products are expected to be slim, yet packed with features and high performance.

This significantly increases the number of components inside the device, complicating the internal design. At the same time, devices must be more compact and lightweight, making it difficult to arrange wiring components in limited space. Advanced design technology is essential, presenting challenges for developers.

Application examples with BK13 Series:
Smartphones, Smartwatches, Tablet PCs, Drones, E-cigarettes, and Other Consumer Devices

Compact and Wide Stacking Height Variations Increase Design Flexibility

To address these challenges, Hirose has developed new stacking height variations ranging from 0.8 to 2.0mm, while retaining the key features of the conventional 0.35mm pitch product—including 5A power contact support, robust construction, and smooth mating. (Some height variations are still under development.)

By increasing the height beyond the conventional 0.6mm pitch, the risk of interference between multiple components is reduced, enabling greater layout flexibility.

With the BK13 Series, customers gain more options and greater adaptability to meet specific design requirements—making it an ideal solution for a wide range of consumer devices.

*0.8, 1.3, and 2.0mm height products are currently under development. If you have questions about the number of pos. variations, please contact our company sales representative.

Features

  1. Supports high current in compact spaces
    • Rated current: 5A for power contact, 0.3A for signal contact (BK13C) / 0.2A (BK13H)
  2.  Fully armored design prevents damage
    • Robust structure protects housing
    • Reduces wear during repeated mating cycles
  3. Multiple solder points improve PCB peeling strength
    • Provides stable connections
  4.  Wide self-alignment range enhances assembly efficiency
    • Enables smooth mating operation
  5. Integrally molded plug and receptacle prevent solder wicking
    • Ensures high contact reliability

Expansion of Product Development

We plan to further expand the stacking height variations, giving customers a broader selection of products.

Mass production: 0.6mm, 1.0mm, 1.5mm
In development: 0.8mm, 1.3mm, 2.0mm

With Hirose’s proven track record in micro connectors and strict quality control, we are committed to delivering high-quality, high-performance connectors that support technological innovation and enhance everyday convenience.

Related

Source: Hirose

Recent Posts

Binder Hybrid Connector Simplifies One Cable Automation

13.5.2026
4

binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

30.4.2026
12

Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

30.4.2026
50

Heatsink Design and Thermal Interface Materials for Reliable Electronics

27.4.2026
35

Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

17.4.2026
32

Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

17.4.2026
32

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

1.4.2026
19

Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

31.3.2026
14

Bourns Expands its Modular Contacts for Power-Dense Systems

19.3.2026
19

Upcoming Events

May 19
16:00 - 17:00 CEST

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Jun 2
16:00 - 17:00 CEST

Calculation, Simulation and Measurement of 800V EMC Filters

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version