Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 5 Electronics Supply Chain Digest

2.2.2026
Reading Time: 6 mins read
A A


Electronics Supply Chain Weekly Digest 1-23-26.

DATAPOINT OF THE WEEK: New car registrations in Europe increased up 2.06% Y/Y in 2025 to 13.2M units, though remained 15% below the average pre-COVID level from 2016 to 2019, according to ACEA data. December registrations increased 7.5% Y/Y and 8.7% M/M. December BEV sales surged 30.5% Y/Y and 21.7% M/M, making Dec the 11th month in the last 12 to see Y/Y BEV growth. BEVs accounted for 26.3% of the market in December, up from 7.5 points from a year prior. PHEV sales also saw significant growth in Dec, rising 36.1% Y/Y and 9.9% M/M. This marks the 10th straight month of strong double-digit Y/Y growth. HEVs increased 5.2% Y/Y and 5.7% M/M in December, accounting for 32.5% of the market. ICE registrations declined 16.8% Y/Y in December, marking its 17th straight month of Y/Y declines.

RelatedPosts

Wk 27 Electronics Supply Chain Digest

Wk 26 Electronics Supply Chain Digest

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

Headlines:

Auto/Transportation

  • Aumovio to cut up to 4,000 jobs as it targets lower R&D intensity amid challenging market
  • BYD targets 1.3M overseas sales in 2026 as it explores assembly in India to bypass import duties after ~5.5K units sold in 2025, per Bloomberg
  • China EV margins pressured as UBS estimates $500–$1,000 per vehicle cost inflation from lithium, metals, and memory chips amid fading stimulus, says CNEV Post
  • EU eases 2035 ICE stance, potentially boosting REEV adoption as Chinese competition rises and BMW/VW target 2026 launches, according to Reuters and TrendForce
  • GM boosts 2026 profit guide to $13B–$15B on pickup/SUV strength despite $3B–$4B tariff headwind and $6B EV charge driving 4Q net loss
  • Honda resumes China output after Nexperia disruption eases, signaling near-term relief for auto semiconductor supply constraints, says DigiTimes
  • Hyundai warns tariffs remain a ~$2.9B annual profit drag as 4Q operating profit drops 40%
  • Stellantis leans into volume recovery with broad 2026 price cuts in France after 2025 sales fell 6.8%, signaling profitability tradeoff, per Reuters
  • Tesla pivots harder toward AI as profit plunges 64% and capex tops $20B in 2026, with Cybercab launch plans, $2B xAI stake, and “TerraFab” fab concept
  • Volvo raises 2026 heavy-truck outlook to 265K NA and 305K Europe as demand stabilizes despite 4Q profit down 9% Y/Y
  • VW aims to export lower-cost China-built vehicles to ASEAN, Middle East, and South America to protect pricing and manage China competition, says Bloomberg

Datacenter

  • Celestica rides AI server surge with 4Q revenue +44% Y/Y to $3.65B and targets $17B in 2026 sales as it expands US/SEA manufacturing
  • Nvidia invests another $2B into CoreWeave to accelerate “AI factory” buildout as GPU-backed capacity becomes a strategic bottleneck, says Bloomberg
  • Malaysia set to more than double data center capacity to ~2,100MW by end-2026 as Johor becomes a key AI compute hub, per Nikkei Asia
  • Meta guides 2026 capex to $115B–$135B, up from ~$72B in 2025
  • OpenAI pursues up to $100B funding raise at ~$730B–$830B valuation from Nvidia, Microsoft, Amazon, per Bloomberg and The Information

Industrial

  • Honeywell 4Q revenue rises 6.4% Y/Y as aerospace and aftermarket strength offset delivery delays
  • Plexus guides March-quarter revenue ahead as Industrial, Healthcare, and Aerospace demand strengthens

IP&E

  • Lightmatter partners with GUC, Synopsys, and Cadence to accelerate CPO roadmaps and break connectivity bottlenecks for next-gen AI systems
  • Meta signs up to $6B multi-year Corning fiber agreement to support AI data center expansion and long-haul connectivity buildout
  • Yageo raises resistor pricing 15%–20% effective Feb 1 as AI demand and metal input inflation drive broader passive component hikes, according to DigiTimes

Semiconductors

  • Alibaba deploys in-house Zhenwu 810E AI processor across clusters to vertically integrate amid rising China self-sufficiency push, says DigiTimes
  • AI server ASIC shipments expected to triple by 2027, according to TrendForce
  • ASML posts record 2025 revenue as AI-driven demand lifts 4Q bookings and supports strong 2026 outlook
  • Chinese display giants Visionox and BOE enter semiconductor glass substrate race, building pilot lines to challenge US/Japan/Korea incumbents, per DigiTimes
  • Nvidia and Apple reportedly eye selective Intel production by 2028, using advanced packaging to diversify beyond TSMC under US supply-chain pressure, according to DigiTimes
  • MediaTek targets $10B ASIC revenue by 2027 as Google partnership scales cloud AI silicon and potential TPU volume reaches ~2.5M units, says DigiTimes
  • Samsung and SK Hynix warn AI-driven demand will keep memory supply tight through 2027, constrained by cleanroom space and packaging capacity, according to Nikkei Asia
  • Microsoft launches Maia 200 on TSMC 3nm to scale inference capacity, with ~330K units forecasted for 2026
  • Micron commits $24B to expand NAND capacity in Singapore with wafer output beginning in 2H28, per DigiTimes
  • Samsung posts record 4Q results as AI-driven memory demand lifts semiconductors and tight supply supports pricing
  • SK hynix posts record 2025 results as AI-driven HBM demand drives revenue surge and margin expansion
  • TI 4Q revenue in line, utilization stronger than expected; 1Q guide points to above-seasonality growth driven by DC and Industrial demand
  • Tesla targets 9-month AI chip iteration cycle with AI5 performance claims and long-term fab ambitions
  • TSMC to exceed 140K CoWoS units/month by end-2026 as Nvidia consumes >50% of capacity, with advanced packaging remaining constrained for years, says DigiTimes
  • VIS licenses TSMC GaN processes to expand power device roadmap across low-to-ultra-high voltage applications in datacenter and automotive power, according to DigiTimes
  • China greenlights >400K Nvidia H200 purchases for Alibaba, Tencent, and ByteDance under conditions, per Bloomberg

Consumer/Other

  • China smartphone shipments slip 0.8% in 4Q to 75.8M units as memory costs rise and subsidies fade, says IDC
  • TrendForce cuts FY26 notebook outlook as 1Q shipments expected to plunge 14.8% Q/Q on CPU shortages and broad component inflation
  • US and Mexico agree to begin USMCA reform talks ahead of July 1 review, with rules-of-origin tightening emerging as key focus, per Reuters
  • US shifts away from price floors for critical minerals, signaling a new approach to domestic production support 

Related

Source: Edgewater Research

Recent Posts

Wk 27 Electronics Supply Chain Digest

13.7.2026
46

Wk 26 Electronics Supply Chain Digest

6.7.2026
62

Wk 25 Electronics Supply Chain Digest

29.6.2026
55

Wk 24 Electronics Supply Chain Digest

15.6.2026
67

Wk 23 Electronics Supply Chain Digest

8.6.2026
74

Wk 22 Electronics Supply Chain Digest

1.6.2026
64

Wk 19 Electronics Supply Chain Digest

11.5.2026
116

Wk 18 Electronics Supply Chain Digest

4.5.2026
100

Wk 17 Electronics Supply Chain Digest

27.4.2026
53

Upcoming Events

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

Jul 29
17:30 - 18:30 CEST

To Ferrite or to Nanocrystalline in Transformer Design

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version