Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KYOCERA AVX Unveils World-First MLCC with Industry-Highest Capacitance 47μF in 0402 Size

13.3.2025
Reading Time: 3 mins read
A A

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has successfully developed the world’s first*1 compact, high-capacity multilayer ceramic chip capacitor (MLCC) with an industry-leading capacitance value of 47µF in the 0402-inch size*2 (1.0mm x 0.5mm).

Mass production scheduled to start in December 2025.

RelatedPosts

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

KYOCERA AVX Releases Vibration-Proof SMD Aluminum Electrolytic Capacitors for Harsh Industrial Designs

KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

The rapid evolution of artificial intelligence (AI) technology is driving a surge in demand for smartphones equipped with generative AI and AI servers.

Additionally, as data processing technology becomes more advanced, the number of integrated components is increasing. Consequently, there is a growing need for ultra-compact components that allow for efficient component mounting within limited board space.

In the case of MLCCs, which are extensively used in these electronic devices, there is a strong expectation for further miniaturization and increased capacitance. At the same time, there is a demand for high reliability in components used in harsh temperature environments due to heat generation and other factors.

The ‘0402-inch size’*2 MLCC developed by our company is the most widely adopted size for smartphones and wearable devices. Through KYOCERA AVX’s unique material and process technologies, we have achieved further thinning of the dielectric and internal electrodes, successfully expanding the capacitance per unit by approximately 2.1 times compared to our previous product (22μF) of the same size.

This contributes significantly to securing the necessary capacitance and reducing the number of components. Moreover, high heat resistance up to +105°C ensures high reliability in harsh temperature environments, such as AI servers.

KYOCERA AVX will continue to advance product development in its electronic components business to meet market needs, contributing to the miniaturization and enhanced functionality of devices such as smartphones and AI servers.

KGM05DR50G476MHKGM05DR50E476MHKGM05DS60E476MH
Size(L×W)1.0mm×0.5mm(T 0.8mmMax.)
Capacitance47μF
Capacitance ToleranceM(±20%)
Operating Temperature Range-55 to 85℃-55 to 105℃
Temperature CharacteristicsX5R(EIA)X6S(EIA)
Rated Voltage4Vdc2.5Vdc2.5Vdc
Mass Production Launch DateScheduled for December 2025
  • *1 Regarding MLCCs in the ‘0402’ size. As of February 2025, according to Kyocera’s research
  • *2 EIA Inch Code

Related

Source: KYOCERA AVX

Recent Posts

Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

6.11.2026
3
Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

6.11.2026
2
Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
3
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
20
Würth Elektronik ICS PowerBusbar PF vertical PCB busbars with flat metal bodies and press-fit pins.

Würth PowerBusbar PF: Vertical Press-Fit Busbars for PCBs

4.11.2026
24
Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

3.11.2026
29

Motor Run Capacitor Safety Classes S0–S3: A Design Guide

2.11.2026
28
Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

Murata RF Switch Connectors Cut PCB Test-Point Area

29.10.2026
34

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

28.10.2026
55

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved