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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

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    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

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KYOCERA AVX Unveils World-First MLCC with Industry-Highest Capacitance 47μF in 0402 Size

13.3.2025
Reading Time: 3 mins read
A A

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has successfully developed the world’s first*1 compact, high-capacity multilayer ceramic chip capacitor (MLCC) with an industry-leading capacitance value of 47µF in the 0402-inch size*2 (1.0mm x 0.5mm).

Mass production scheduled to start in December 2025.

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KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

The rapid evolution of artificial intelligence (AI) technology is driving a surge in demand for smartphones equipped with generative AI and AI servers.

Additionally, as data processing technology becomes more advanced, the number of integrated components is increasing. Consequently, there is a growing need for ultra-compact components that allow for efficient component mounting within limited board space.

In the case of MLCCs, which are extensively used in these electronic devices, there is a strong expectation for further miniaturization and increased capacitance. At the same time, there is a demand for high reliability in components used in harsh temperature environments due to heat generation and other factors.

The ‘0402-inch size’*2 MLCC developed by our company is the most widely adopted size for smartphones and wearable devices. Through KYOCERA AVX’s unique material and process technologies, we have achieved further thinning of the dielectric and internal electrodes, successfully expanding the capacitance per unit by approximately 2.1 times compared to our previous product (22μF) of the same size.

This contributes significantly to securing the necessary capacitance and reducing the number of components. Moreover, high heat resistance up to +105°C ensures high reliability in harsh temperature environments, such as AI servers.

KYOCERA AVX will continue to advance product development in its electronic components business to meet market needs, contributing to the miniaturization and enhanced functionality of devices such as smartphones and AI servers.

KGM05DR50G476MHKGM05DR50E476MHKGM05DS60E476MH
Size(L×W)1.0mm×0.5mm(T 0.8mmMax.)
Capacitance47μF
Capacitance ToleranceM(±20%)
Operating Temperature Range-55 to 85℃-55 to 105℃
Temperature CharacteristicsX5R(EIA)X6S(EIA)
Rated Voltage4Vdc2.5Vdc2.5Vdc
Mass Production Launch DateScheduled for December 2025
  • *1 Regarding MLCCs in the ‘0402’ size. As of February 2025, according to Kyocera’s research
  • *2 EIA Inch Code

Related

Source: KYOCERA AVX

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