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    Power Inductors Future: Minimal Losses and Compact Designs

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    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

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    Coupled Inductors in SEPIC versus Flyback Converters

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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Murata Integrates Component Models into Cadence EDA Tools

    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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LTSpice for the Validation of Power Converters

16.10.2023
Reading Time: 1 min read
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This webinar by Würth Elektronik focuses on use of LTSpice to automate validation of electronic design in an example of power converter simulation.

Validation of the prototypes of power converters is an important step in the design, unfortunately it’s time consuming and can lead to hardware changes, sometimes late in your project.

RelatedPosts

Power Inductors Future: Minimal Losses and Compact Designs

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

Connector PCB Design Challenges

Insufficient validation on the other hand can lead to field failures. Using LTSpice provides amazing opportunities to automate the validation of your design, even before you build your first prototype by anticipating the stress levels of each passive and active component you are then able to pick the reference that will perfectly suit your needs.

Thanks to iteration and randomization you can validate your design over the complete range of:

  • tolerance
  • input voltage
  • output current
  • load transient

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Source: Würth Elektronik

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