Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Nanometers-thin Niobium Oxide (NbO2) Memristor Can Bring Breakthrough to Neuromorphic AI Hardware Designs

11.4.2022
Reading Time: 2 mins read
A A
Schematic illustration of the structure and cross-sectional transmission electron micrograph displaying a part of the structure of the element

Schematic illustration of the structure and cross-sectional transmission electron micrograph displaying a part of the structure of the element

In a paper recently published in Nature, researchers Suhas Kumar of Hewlett Packard Laboratories, R. Stanley Williams with Texas A&M University, and the late Stanford PhD student Ziwen Wang introduce an isolated nanoscale electronic circuit element that can perform nonmonotonic operations and transistorless all-analogue computations using nanometers-thin Niobium Oxide (NbO2) memristor. With input voltages, it can output not just simple spikes but a whole array of neural activity such as bursts of spikes, self-sustained oscillations, and other brain activities.

“This work paves a way towards very compact and densely functional neuromorphic computing primitives, and energy-efficient validation of neuroscientific models,” the researchers say. The IEEE (Institute of Electrical and Electronics Engineers) hails the paper as a breakthrough.

Current hardware approaches to neuromorphic AI rely on elaborate transistor circuits to simulate biological functions. Generating neuromorphic action potentials in a circuit element theoretically requires a minimum of third-order complexity, but there have been no previous demonstrations of any isolated third-order element.

The researchers fabricated sub-100-nm components, each of which incorporates a NbO2 volatile Mott memristive switch, an internal parallel capacitor, and an internal series resistor.

RelatedPosts

Researchers Demonstrated Quantum Memristor as a Link between AI and Quantum Computing

Graphene-based Memristors Show Promise for Brain-Based Computing

Purity of Materials May be the Key in Further Memristor Development

The most crucial part of the element is the nanometers-thin niobium oxide (NbO2) volatile Mott memristor. A memristor is a non-linear two-terminal electrical component proposed in 1971 by electrical engineer and computer scientist Leon Chua, who later extended the notion of memristive systems to capacitors and inductors.

Memristors can potentially be made into non-volatile solid-state memory, which could allow greater data density than hard drives with access times similar to Dynamic Random Access Memory. A potential application of memristors is in analog memories for superconducting quantum computers.

The proposed Mott memristors also have the ability to reflect temperature-driven changes in resistance. Mott transition materials therefore vary between insulating and conducting according to their temperature, which can result in current spikes that resemble a neuron’s action potential.

The researchers say it is important to fine-tune the element’s material and physical parameters to identify a combination that works. “You cannot find this by accident,” Williams told IEEE Spectrum. “Everything has to be perfect before you see this characteristic, but once you’re able to make this thing, it’s actually very robust and reproducible.”

The researchers demonstrate that it is possible to incorporate the Mott transition in NbO2 as an additional dynamical process to construct an isolated nanoscale electronic circuit element with third-order complexity, which can then be designed to produce optimal interactions among its constituent electrical and thermal components.

They further show that transistorless all-analogue network of neuromorphic elements can solve computationally difficult problems that have far-reaching applications in alleviating the von Neumann bottleneck of present digital computers. The researchers say this result enables extremely compact and highly functional neuromorphic computing primitives.

Related

Source: Nature

Recent Posts

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
15
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
23

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
78

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
142

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
108

Molecular Memristor Shows Record 145 kH Emergent Inductance

12.5.2026
82

Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

11.5.2026
161

Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

7.5.2026
407

High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

7.5.2026
213

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved