Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

New Vishay High Power Thin Film Chip Resistors Replace Larger Devices or Multiple Same-Size Resistors to Lower Costs and Save Space

15.11.2017
Reading Time: 2 mins read
A A

source: Vishay news

MALVERN, Pa. — November 13, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of Automotive Grade thin film chip resistors that features the industry’s highest rated power dissipation in the compact 0402, 0603, and 0805 case sizes. For electronics in automotive, industrial, and renewable energy applications, Vishay Beyschlag MC HP series devices combine high operating temperatures to +175 °C with low load life drift ≤ 0.2 % after 1,000 hours of operation at rated dissipation.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

With rated power dissipation up to 0.4 W, the MCS 0402 HP, MCT 0603 HP, and MCU 0805 HP each deliver over two times the dissipation of standard thin film chip resistors in their respective case size, while also exceeding the ratings of components in the next largest case size. To save space, reduce component counts, and lower costs, this allows designers to use compact resistors in place of larger devices, or replace multiple resistors of the same case size.

The AEC-Q200 qualified devices released today feature a resistance range from 1 Ω to 100 kΩ, TCR down to ± 25 ppm/K, and tolerances down to ± 0.1 %. The MC HP series offers superior temperature cycling robustness and advanced sulfur resistance as verified according to ASTM B 809. Suitable for processing on automatic SMD assembly systems, the lead (Pb)-free devices are RoHS-compliant.

The MCS 0402 HP, MCT 0603 HP, and MCU 0805 HP are the perfect choice for most fields of modern electronics in which power dissipation, reliability, stability, and robust design are major concerns. Typical applications will include DC/DC converters; power supply, motor, and electronic control units; inverters; and test and measuring equipment.

Device Specification Table:

Part number MCS 0402 HP MCT 0603 HP MCU 0805 HP
Case size 0402 0603 0805
Resistance range (Ω) 47 to 100 k 1 to 100 k 1 to 100 k
Resistance tolerance (%) ± 0.1; ± 0.5 ± 1
TCR (ppm/K) ± 25; ± 50
Rated dissipation P85 (W) 0.200 0.250 0.400
Operating voltage (V) 50 75 150
Operating temp. range (°C) -55 to +175

Samples and production quantities of the new thin film chip resistors are available now, with lead times of six to eight weeks for large orders.

Related

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
9

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

4.9.2026
4

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
6

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
9

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
15

Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

1.9.2026
12

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

1.9.2026
8

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

31.8.2026
19

Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

28.8.2026
44

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved