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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

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    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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Overvoltage Protection Selection Guidelines: TVS Diodes, MOVs, and ESD MOV Varistors

1.10.2024
Reading Time: 1 min read
A A

This video presented by Eaton, as part of Industry Tech Days organized by All About Circuits, provides an explanation and selection guideline on overvoltage protection devices such as TVS Diodes, MOVs, and polymer ESD MOV Varistors.

The comparative analysis of these components, highlighting their advantages and limitations.

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The presentation explores insights into the criteria for selecting the appropriate overvoltage protection based on factors such as response time, energy handling capacity, and form factor.

Attendees will be equipped with the knowledge to make informed decisions in designing robust and resilient electronic circuits.

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Source: Eaton, All about circuits

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