Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Skeleton Releases UL-Certified Ultracapacitors Launched for Warehouse Robotics and Smart Factories

6.12.2019
Reading Time: 2 mins read
A A

Skeleton Technologies, the European market leader for ultracapacitors and ultracapacitor energy storage systems for automotive, transportation, and grid applications, is bringing to market a new ultracapacitor product platform, the SkelCap SCA0300, to address the fast-growing markets in manufacturing and warehouse logistics.

The strict power quality requirements in manufacturing are driving the demand for ultracapacitor-based UPS solutions, and the SCA0300 product platform is ideally suited to systems ensuring high power quality to protect sensitive manufacturing equipment.

RelatedPosts

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Lightweight Model for MLCC Appearance Defect Detection

The growth of warehouse and fulfillment center robotics is driven by the rapid growth of e-commerce. Changing consumer behaviour and expectations of quick deliveries are creating new opportunities for ultracapacitor-powered solutions in intralogistics where shuttle and AGV  (Automated Guided Vehicle) manufacturers are replacing batteries with ultracapacitor solutions due to power, reliability, and lifetime advantages.

At 300F, the new product platform is Skeleton’s answer to one of the most popular ultracapacitor sizes on the market and is designed to be easily mountable to PCB boards, allowing efficient assembly for a variety of applications. The high power and excellent thermal characteristics of SCA0300 are the result of the low ESR, or internal resistance, of the cell –something of a Skeleton Technologies specialty.

“The decision to develop a product platform in the 300F size and form factor came down to significant interest from the market, proven by the various applications already utilizing this cell size. The advantages provided by our low resistance and our patented manufacturing technologies make the SCA0300 the leading product platform in terms of power density, low heat generation, and lifetime.

We have already made a successful market entry in the elevator market by reducing energy consumption of elevators, together with Epic Power, and are proud to be saving energy by tens of percents in elevators, both for new installations and in retrofit projects around the world.”, said Dr. Sebastian Pohlmann, Head of Cell Development at Skeleton Technologies.

The central location and modern production technologies applied at Skeleton Technologies’ production facility in Saxony, Germany, provide further advantages to customers for the cell packs and modules based on the new product platform.

“The new SCA0300 product platform, combined with our ultracapacitor management system and modern production processes, enables us to provide reliable, state-of-the-art ultracapacitor modules at a cost-efficient price point, while still maintaining the highest performance and quality in the industry”, explains Taavi Madiberk, the CEO of Skeleton Technologies.

“The SCA0300 also complies with the strict IATF standard used in the automotive industry, ensuring the safety, quality, and reliability required in passenger vehicles, and also meets the requirements of applications in medical machinery, oil & gas, grid, and renewable energy production.”

Related

Source: Skeleton Technologies

Recent Posts

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

3.11.2025
6

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

3.11.2025
4

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
1

DMASS Reports First Positive Signs of European Distribution Market in Q3/25

3.11.2025
3

TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

3.11.2025
2

Samtec Expands Offering of Slim, High-Density HD Array Connectors

30.10.2025
9

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

30.10.2025
20

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

30.10.2025
23

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
32

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
32

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version