Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TAIYO YUDEN Largest Capacitance with its Low-Profile Ceramic Capacitors

4.10.2016
Reading Time: 2 mins read
A A

source: Taiyo Yuden news

TOKYO, September 27, 2016
TAIYO YUDEN CO., LTD. announced today the commercialization of the low-profile multilayer ceramic capacitors PMK105 BJ474ML and PMC105 BJ474ML (both 1.0 x 0.5 x 0.11 mm, with height as the maximum value).

RelatedPosts

Bourns Releases High Inductance Common Mode Choke

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

 

These products can be used in devices that are required to be small and thin, such as smartphones and wearable devices, for the purpose of decoupling IC power supply lines for embedded-parts multilayer wiring substrates and various modules. The capacitance enhancement technique TAIYO YUDEN has nurtured enables the capacitor products to achieve a capacitance of 0.47μF at a height of 0.11 mm, which is the world’s thinnest profile for multilayer ceramic capacitors. Production of this multilayer ceramic capacitor commenced at the company’s Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan) from September 2016 at a production rate of 10 million units per month, with a sample price of 15 yen per unit.

Technology Background
Multilayer ceramic capacitors are placed near IC devices mounted in a smartphone or a wearable device for the purpose of decoupling. In accordance with reductions in the size and thickness of
devices and the need for improved functionality, the mounting area available for various parts is decreasing. There is a need to implement higher-density mounting, which includes mounting
low-profile parts inside or at the back of the IC package and embedding them in the substrate, rather than using the conventional method of mounting parts on the printed circuit board.
Furthermore, for stably driving the IC device, multilayer ceramic capacitors for the purpose of decoupling are required to have a larger capacity while maintaining their small form.
To address this market need, TAIYO YUDEN has commercialized the 1005 -size multilayer ceramic capacitors with the industry’s largest capacitance of 0.47μF in a 0.11 mm profile by refining the conventional capacitance enhancement technique to reduce the thickness of the external electrodes. Moreover, the PMC105 BJ474ML product has copper-plated electrodes, which are suitable for mounting on embedded -parts multilayer wiring substrates. We will continue to actively promote the development of low-profile multilayer ceramic capacitors with a smaller, thinner profile and a higher capacitance.

Applications
For decoupling IC power supply lines for embedded-parts multilayer wiring substrates and various modules, particularly in devices that are required to be small and thin, such as
smartphones and wearable devices.

 

Related

Recent Posts

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
8

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

14.10.2025
21

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

10.10.2025
40

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
33

Advances in the Environmental Performance of Polymer Capacitors

8.10.2025
62

Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

8.10.2025
28

Paumanok Releases Capacitor Foils Market Report 2025-2030

7.10.2025
28

Modelithics Welcomes CapV as a Sponsoring MVP

7.10.2025
4

Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

3.10.2025
26

Electrolyte Selection and Performance in Supercapacitors

3.10.2025
41

Upcoming Events

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version