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TDK Offers Compact Common-Mode EMC Filters for High-Speed Automotive Applications

22.2.2022
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TDK Corporation has developed the KCZ1210DH series common-mode filters for automotive applications. This series provides a noise control function for high-speed differential transmission signal lines for automobiles and is available in 1210 case size (1.25 x 1.0 x 0.5 mm).

An increase in advanced driver-assistance systems (ADAS) has led to rapidly growing demands for forward-sensing cameras and around-view monitors. Common-mode filters are used in autonomous vehicle camera signal lines as anti-noise products. To handle large-volume video signals, the signal transmission rate will continue increasing to build safe and secure autonomous driving systems.

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TDK’s High-Impedance Multilayer Common Mode Filters Mitigates Noise Issues in Automotive Interfaces

This product supports high-speed signals with over 10 Gbps transmission rates. Additionally, it contributes to noise control in the GHz band generated due to increased speed. By supporting an operating temperature range from -55 ºC to +125 ºC and adopting a conductive resin-based electrode, it controls product cracks from thermal shock while increasing durability against mechanical stresses like substrate strains. The outer dimensions are 1.25 (L) x 1.0 (W) x 0.5 mm (H), which saves board mounting space. Mass-production began in February 2022.

TDK is working on enhancing its inductive devices for ADAS, and moving forward, will expand its line of miniaturized common-mode filters, further supporting market demands for higher-speed differential signals.

Main applications

  • High-speed interface
  • HDMI1.4/ 2.0 (3.4 Gbps / 6 Gbps), LVDS/MIPI D-PHY (4.5 Gbps), USB3.0 / 3.1 Gen1 (5 Gbps), USB3.1 Gen2 (10 Gbps), Next Gen Interface (10 Gbps~)
  • Advanced driver-assistance systems (ADAS)

Main features and benefits

  • Supports high-speed differential transmission of over 10 Gbps
  • Operable at 125 ºC, the maximum temperature
  • Adoption of a conductive resin-based electrode reduces mechanical and thermal stresses.
  • A compact size of 1.25 (L) x 1.0 (W) x 0.5 mm (H), to facilitate space saving

Key data

Source: TDK

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