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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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Vishay Releases Very Fast-Acting Thin Film Chip Fuse for Automotive Applications

19.8.2021
Reading Time: 2 mins read
A A

Vishay Intertechnology is releasing new very fast-acting thin film chip fuse featuring current ratings from 0.5 A to 5.0 A. The device delivers outstanding stability of fusing characteristics for EVs and HEVs.

Vishay Intertechnology, Inc. introduced a new very fast-acting thin film chip fuse. For automotive applications, the Vishay Beyschlag MFU 0603 AT is AEC-Q200 qualified and features current ratings from 0.5 A to 5.0 A.

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The device released today will be used in electric (EV) and hybrid electric (HEV) vehicles, where it will provide protection for voltage sensing circuits in battery management systems, in addition to circuit protection for small loads. For these applications, the fuse’s highly controlled thin film manufacturing process guarantees an outstanding stability of fusing characteristics.

Offering a robust design, the MFU 0603 AT consists of a homogeneous metal alloy film deposited on a high grade ceramic substrate, with fuse elements covered by a protective coating designed for electrical, mechanical, and climatic protection. The device offers advanced sulfur resistance in accordance with ASTM B 809, and it withstands 85 °C / 85 % R.H. for 1000 h biased humidity testing and testing for thermal shock.

Offered in the 0603 case size, the fuse features a rated voltage of up to 63 V, breakdown capacity of 50 A, and operating temperature range of -55 °C to +125 °C. RoHS-compliant, halogen-free, and Vishay Green, the fuse is suitable for processing on automatic SMD assembly systems and automatic soldering using wave, reflow, or vapor phase.

Samples and production quantities of the MFU 0603-FF AT are available now, with lead times of 10 to 14 weeks.

Related

Source: Vishay Intertechnology

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