Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

    From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

    Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

    YAGEO Introduces Automotive MOV Surge Protection Varistor

    TDK Releases Compact SMD Gate Drive Transformers for xEV

    Wk 26 Electronics Supply Chain Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

    From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

    Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

    YAGEO Introduces Automotive MOV Surge Protection Varistor

    TDK Releases Compact SMD Gate Drive Transformers for xEV

    Wk 26 Electronics Supply Chain Digest

    High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

    Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Vishay RF MLCCs Offer Reliability and Design Flexibility With Industry’s First Operating Temps to +200 °C in Small Cases

3.5.2018
Reading Time: 2 mins read
A A

source: Vishay news

MALVERN, Pa. — August 7, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the industry’s first surface-mount multilayer ceramic chip capacitors (MLCCs) for high frequency RF and microwave applications to offer an operating temperature range to +200 °C. For telecom base stations and military communication systems, the Vishay Vitramon VJ HIFREQ HT series provides ultra high Q and low ESR in four compact case sizes.

RelatedPosts

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

For high power communication transmitters and high frequency inverters exposed to temperatures of +175 °C or higher, designers previously had to rely on MLCCs only qualified to +150 °C. With their operating temperature range from -55 °C to +200 °C, the devices released today provide reliable, long term performance in these applications. For increased design flexibility, the MLCCs’ small 0402, 0603, 0805, and 1111 case sizes allow for placement close to components with high dissipation, such as SiC and GaN switches.

VJ HIFREQ HT series devices are based on an ultra stable ceramic dielectric and offer a high serial resonant frequency (SRF) and parallel resonant frequency (PRF). The MLCCs feature broad working voltages from 16 V to 500 V and a wide capacitance range from 0.1 pF to 3.3 nF, with tolerance as tight as ± 0.05 pF. The devices offer an excellent aging rate of 0 % per decade and high ESD withstand capabilities to protect against high voltage transients.

Manufactured in noble metal electrode (NME) technology with a wet build process, the capacitors are available with a variety of RoHS-compliant termination finishes, including nickel barrier with 100 % matte tin plate for reflow assembly (code “X”), non-magnetic copper barrier for applications sensitive to magnetic interference (code “C”), and silver-palladium for conductive epoxy assembly (code “E”). The VJ HIFREQ HT series is also available with a lead-bearing (minimum 4 %) termination finish (code “L”). The devices are halogen-free and Vishay Green (excluding “L” termination).

Samples and production quantities of the VJ HIFREQ HT series are available now, with a lead time of nine weeks for larger orders.

Device Specification Table:

Case Max. voltage (V) Capacitance
Minimum Maximum
0402 50 0.1 pF 47 pF
0603 200 0.1 pF 270 pF
0805 250 0.1 pF 1.0 nF
1111 500 0.2 pF 3.3 nF

Related

Recent Posts

Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

8.7.2026
17

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

7.7.2026
34

Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

7.7.2026
14

YAGEO Introduces Automotive MOV Surge Protection Varistor

7.7.2026
10

TDK Releases Compact SMD Gate Drive Transformers for xEV

7.7.2026
15

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

2.7.2026
75

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

2.7.2026
56

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
570

YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

1.7.2026
26

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version